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Formula and processing technology of pumpkin submicron powder thin pancakes

A technology of ultrafine powder and pumpkin, which is applied in baking, dough processing, baked food, etc., to achieve the effects of extending shelf life, improving taste, and promoting absorption and utilization

Inactive Publication Date: 2018-05-01
张道松
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] Pancake is a popular traditional convenience food, which has the characteristics of storage resistance, convenient portability, and diversified formulas. However, adding pumpkin superfine powder to pancakes is still a blank in the market and research

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0019] Embodiment 1: a kind of pumpkin superfine powder pancake, is made up of the raw material of following weight portion: flour 480g, semolina 880g, millet flour 950g, pumpkin superfine powder 36g, purified water 2100g, above-mentioned raw material is through preparing materials, stirring, modulation batter , fermenting, spreading, folding and forming, baking (the best tasting temperature is 110°C for 12 minutes), spreading and cooling, each bag is packed in 200g.

Embodiment 2

[0020] Embodiment 2: the processing method of the present embodiment is the same as embodiment 1, and similarities are not repeated, and difference is that the composition of raw material weight portion is different: flour 500g, semolina 1000g, millet flour 1000g, pumpkin superfine powder 40g, Purified water 2000g.

Embodiment 3

[0021] Embodiment 3: the processing method of the present embodiment is the same as embodiment 1, and similarity is not repeated, and difference is that the composition of raw material weight part is different: flour 500g, semolina 950g, millet flour 950g, pumpkin superfine powder 42g, 2200g of purified water.

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PUM

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Abstract

The invention relates to the field of food processing, and provides a formula of pumpkin submicron powder thin pancakes. The formula consists of the following raw materials in parts by weight of 480-520 parts of flour, 880-1000 parts of coarse wheat flour, 900-1020 parts of millet flour, 35-43 parts of pumpkin submicron powder and 2000-2300 parts of purified water, and preferably 500 parts of theflour, 1000 parts of the coarse wheat flour, 1000 parts of millet flour, 40 parts of the pumpkin submicron powder and 2000 parts of the purified water. The pumpkin submicron powder thin pancakes disclosed by the invention are uniform, fine and smooth in structure, crisp and chewable in mouth feel, greenish-yellow in color, fragrant and sweet after being put into mouths, rich in aftertaste, slightin pumpkin fragrance and high in nutrient value, can facilitate digestion and promote absorption, are suitable for crowds of different age stages to eat, and are particularly suitable for crowds poorin the digestion functions of the intestine and the stomach to eat.

Description

technical field [0001] The invention relates to the field of food processing, in particular to a formula of pumpkin superfine powder pancake and a manufacturing process thereof. Background technique [0002] Ultrafine powder has small particle size, large specific surface area, improved solubility and dispersion performance, and can be formulated with a variety of beverages and foods, and its nutrients can be fully digested and absorbed by the human body. When it is added to food, there will be no rough feeling in the mouth, so it can make the food not only rich in nutrients and health care ingredients, but also make use of the previously discarded dietary fiber to form a special style of food. Adding processed superfine powder to food can not only make full use of the active ingredients in the food, but also change the structure and flavor of the food, and promote the human body's absorption and utilization of other nutrients in the food. [0003] Pancake is a popular trad...

Claims

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Application Information

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IPC IPC(8): A21D13/44A21D2/36
CPCA21D13/44A21D2/36A21D2/366
Inventor 张道松
Owner 张道松
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