Gum dipping formula for high-temperature-resistant conveying belts
A technology with high temperature resistance and formula, which is applied in the field of industrial fabrics, can solve the problems of adhesive layer failure, poor high temperature resistance, etc., and achieve the effect of long service life and good high temperature aging performance
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Embodiment 1
[0026] The invention discloses a high temperature-resistant dipping formula, which includes a first bath formula and a second bath formula, and the parts by weight are as follows:
[0027] Among them, the formula of the first bath includes the following contents: caprolactam blocked isocyanate 40%: 55, RF resin liquid: 35, soft water: 878, wherein, the formula of RF resin liquid is: soft water: 42, sodium hydroxide 5%: 10, Hydroquinone solid: 13, formaldehyde 37%: 25.
[0028] A second bath recipe includes the following:
[0029] ①The formula of RF resin liquid is: soft water: 42, sodium hydroxide 5%: 10, resorcinol solid: 15, formaldehyde 37%: 25, RF resin liquid: 425;
[0030] ②The formula of RFL-dipping liquid is: RF resin liquid: 425, soft water: 90, VP latex 40%: 420.
[0031] Wherein, the solid weight ratio of RF resin liquid and latex L is between 1:4, and the total solid content of the final RFL-dipping liquid is between 14%.
Embodiment 2
[0033] The invention discloses a high temperature-resistant dipping formula, which includes a first bath formula and a second bath formula, and the parts by weight are as follows:
[0034] Wherein, the formula of the first bath includes the following contents: caprolactam blocked isocyanate 40%: 55, RF resin liquid: 60, soft water: 1000, wherein, the formula of RF resin liquid is: soft water: 52, sodium hydroxide 5%: 12, Hydroquinone solids: 20, formaldehyde 37%: 30.
[0035] A second bath recipe includes the following:
[0036] ①The formula of RF resin liquid is: soft water: 450, sodium hydroxide 5%: 12, resorcinol solid: 20, formaldehyde 37%: 30, RF resin liquid: 472;
[0037] ②The formula of RFL-dipping liquid is: RF resin liquid: 482, soft water: 100, VP latex 40%: 460.
[0038] Wherein, the solid weight ratio of RF resin liquid and latex L is between 1:6, and the total solid content of the final RFL-dipping liquid is between 25%.
Embodiment 3
[0040] The invention discloses a high temperature-resistant dipping formula, which includes a first bath formula and a second bath formula, and the parts by weight are as follows:
[0041] Wherein, the formula of the first bath includes the following contents: caprolactam blocked isocyanate 40%: 55, RF resin liquid: 48, soft water: 900, wherein, the formula of RF resin liquid is: soft water: 48, sodium hydroxide 5%: 11, Hydroquinone solids: 17, formaldehyde 37%: 27.
[0042] A second bath recipe includes the following:
[0043] ①The formula of RF resin liquid is: soft water: 435, sodium hydroxide 5%: 11, resorcinol solid: 17, formaldehyde 37%: 25, RF resin liquid: 448,
[0044] ②The formula of RFL-dipping liquid is: RF resin liquid: 448, soft water: 95, VP latex 40%: 440.
[0045] Wherein, the solid weight ratio of RF resin liquid and latex L is between 1:5, and the total solid content of the final RFL-dipping liquid is between 18%.
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