Polyamic acid solution composition and polyimide film

A technology of polyimide film and polyamic acid, which is applied in coatings, printed circuit components, printed circuits, etc., can solve problems such as lack of flexibility, glass fragility, and insufficient glass strength, and achieve small phase difference and excellent durability. thermal effect

Active Publication Date: 2018-04-20
UBE IND LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, when glass is thinned for weight reduction, it is difficult to use glass as a flexible substrate due to insufficient strength, brittle glass, and lack of flexibility.

Method used

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  • Polyamic acid solution composition and polyimide film
  • Polyamic acid solution composition and polyimide film

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0101] Into a 500 mL (inner volume) glass reactor equipped with a stirrer and a nitrogen filling / discharging tube was placed 420 g of N-methyl-2-pyrrolidone as a solvent. Then 16.1910 g (0.0809 mol) ODA, 12.0734 g (0.0347 mol) BAFL, 11.0990 g (0.0289 mol) CpODA and 40.5803 g (0.0866 mol) HTAC (PPD) were added thereto, and the mixture was stirred at 50° C. to obtain A polyamic acid solution with a solid content of 15.17%.

[0102] The polyamic acid solution was coated on a glass plate as a substrate with a wire bar coater. The coating film was heated from 50° C. to 350° C. at a rate of temperature increase of 10° C. / minute in a nitrogen atmosphere, and then heated at 350° C. for 5 minutes to form a polyimide film having a thickness of 10 μm on a glass plate.

[0103] The obtained polyimide film was peeled off from the glass plate, and various properties were measured. The results are shown in Table 1.

Embodiment 2

[0105] Into a 500 mL (inner volume) glass reactor equipped with a stirrer and a nitrogen filling / discharging tube was placed 420 g of N-methyl-2-pyrrolidone as a solvent. To this was then added 16.1910 g (0.0809 mol) ODA, 12.0734 g (0.0347 mol) BAFL, 11.0990 g (0.0289 mol) CpODA, 40.5803 g (0.0866 mol) HTAC (PPD) and 1.1105 g (0.0116 mol) 1,2-DMZ , and the mixture was stirred at 50° C. to obtain a polyamic acid solution with a solid content of 15.17%.

[0106] A polyimide film was formed in the same manner as in Example 1 except that this polyamic acid solution was used, and various properties were measured. The results are shown in Table 1.

Embodiment 3

[0108] Into a 500 mL (inner volume) glass reactor equipped with a stirrer and a nitrogen filling / discharging tube was placed 420 g of N-methyl-2-pyrrolidone as a solvent. Then 19.5454 g (0.0976 mol) ODA, 8.5019 g (0.0244 mol) BAFL, 23.4472 g (0.0610 mol) CpODA and 28.5761 g (0.0610 mol) HTAC (PPD) were added thereto, and the mixture was stirred at 50°C to obtain a solid A polyamic acid solution with a content of 15.12%.

[0109] A polyimide film was formed in the same manner as in Example 1 except that this polyamic acid solution was used, and various properties were measured. The results are shown in Table 1.

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Abstract

The invention discloses a polyamic solution composition and a polyimide film. The present invention pertains to a polyimide film comprising mainly a polyimide obtained by polymerizing a tetracarboxylic acid component and a diamine component, wherein the tetracarboxylic acid component consists of one or more phthalic anhydride structure-free tetracarboxylic dianhydrides (a1) in which at least one of the bonds connecting the two cyclic acid anhydride structures in the molecule is a freely rotatable bond, and one or more tetracarboxylic dianhydrides (a2) with no freely rotatable bonds in the molecule having an alicyclic structure and the two cyclic acid anhydride structures sharing at least one carbon-carbon bond with an alicyclic structure, and the diamine component includes 5-50 mol% of oneor more diamines having a 9,9-diphenylfluorene structure.

Description

technical field [0001] The present invention relates to a polyamic acid solution composition and a polyimide film. Background technique [0002] Conventionally, glass substrates have been used in electronic devices such as flat panel displays including liquid crystal display elements or organic EL display elements. However, when the glass is thinned for weight reduction, the strength of the glass is insufficient, there is a problem that the glass is fragile, and it also lacks flexibility, so it is difficult to use the glass as a flexible substrate. Therefore, studies have also been conducted to use easily lightweight, thinner, and flexible resin materials (such as polyimide films) as substitute materials for glass, and various polyimides have been proposed (such as Patent Documents 1 to 3 Wait). [0003] reference list [0004] patent documents [0005] Patent Document 1: Japanese Patent Laid-Open No. 2007-231224 [0006] Patent Document 2: WO2013 / 179727A1 [0007] Pat...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08G73/10C08J5/18H05K1/03
CPCC08J5/18C08J2379/08C08G73/1042C08G73/105C08G73/1075C09D179/08C08G73/1007C08G73/1078H05K1/0346H05K1/03C08L79/08C08L2201/56C08L2203/16
Inventor 中山知则中山刚成北山直树
Owner UBE IND LTD
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