cover film

A technology of covering film and body film, which is applied in the direction of film/sheet adhesive, non-metallic protective layer, circuit bendable/stretchable parts, etc., which can solve the problem of lack of flexibility and poor processing suitability , Poor operability and other problems, to achieve the effect of reduced FPC protection performance, excellent flexural characteristics, and reduced adverse conditions

Active Publication Date: 2022-03-22
FUJIMORI KOGYO CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, a thin polyimide film has problems of poor processability in the manufacturing process and poor handleability when attached to FPC
[0005] In addition, in the conventional cover film, since it is difficult to reduce the thickness, the flexibility is lacking, so the followability to the level difference of the FPC is not sufficient, and it becomes the cause of defects such as the generation of voids and expansion during the heating process.
Therefore, it is difficult to sufficiently reduce the thickness of the entire FPC bonded with the cover film

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0084] A polyethylene terephthalate (PET) film having a thickness of 50 μm subjected to release treatment on one surface was used as the support film 11 .

[0085] A solvent-soluble polyimide resin containing 50 parts by weight of a phosphorus-based flame retardant per 100 parts by weight of the resin was cast-coated on one surface of the support film 11 so that the thickness after drying was 1 μm. The coating solution was dried to form the first insulating layer 12 .

[0086] On the first insulating layer 12, a coating of a solvent-soluble polyimide resin that does not contain a flame retardant and has a tensile elongation after drying of 170% is cast on the first insulating layer 12 so that the thickness after drying is 3 μm. The liquid is applied and dried to form the second insulating layer 13 .

[0087] A thermosetting adhesive was applied on the second insulating layer 13 so that the thickness after drying was 8 μm, and dried to form a thermosetting adhesive layer 14, a...

Embodiment 2、3

[0089] In the same manner as in Example 1, except that the ratio of the phosphorus-based flame retardant contained in the first insulating layer 12 was set to 100 parts by weight in Example 2 and 150 parts by weight in Example 3, , Obtain the covering film of embodiment 2,3.

Embodiment 4～6

[0091] Except that the coating liquid for forming the second insulating layer 13 is a coating liquid of a solvent-soluble polyimide resin containing 20 parts by weight of a phosphorus-based flame retardant with respect to 100 parts by weight of the resin, and In the same manner as in Examples 1 to 3, the covering films of Examples 4 to 6 were obtained.

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Abstract

The present invention provides a cover film that has good processability and handleability and is excellent in followability to FPC even if it is a thin film. The cover film (10) provided by the present invention is characterized in that the cover film (10) is formed by sequentially laminating a first insulating layer (12), a second insulating layer (13) on one surface of a support film (11), thermosetting Formed from a permanent adhesive layer (14), the first insulating layer (12) contains a flame retardant, and the support film (11) is removed, the first insulating layer (12), the second insulating layer (13 ), a laminate (15) composed of a thermosetting adhesive layer (14) has a tensile elongation of 100% or more.

Description

technical field [0001] The present invention relates to a cover film, and more specifically, to a cover film that has good processability and laminating workability in the process of manufacturing a base material and is resistant to unevenness or unevenness of a flexible printed circuit board (hereinafter referred to as FPC). Film cover film with excellent step followability. Background technique [0002] In mobile electronic devices such as mobile phones, electronic components are integrated on printed circuit boards in order to reduce the external dimensions of the housing and suppress the thinness e to facilitate movement. In addition, in order to reduce the external dimensions of the frame, the printed circuit board is divided into multiple parts, and a flexible FPC is used on the connection line between the divided printed circuit boards, so that the printed circuit board can be folded or made slide. [0003] In addition, since recent mobile information terminals (sma...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K1/02H05K3/28
CPCH05K1/0271H05K1/0283H05K3/281C09J7/20C09J163/00C09J175/04B32B7/02B32B2307/206B32B2307/3065B32B2307/54
Inventor 竹山早苗野村直宏樱木乔规
Owner FUJIMORI KOGYO CO LTD
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