Epoxy resin and organic silicon composite pouring sealant and preparation method thereof

Abstract

The invention discloses an epoxy resin and organic silicon composite pouring sealant and a preparation method thereof. The epoxy resin and organic silicon composite pouring sealant is composed of a component A and a component B which are in the weight ratio of 1:(1-2); the component A comprises the following raw materials in parts by weight: 45-65 parts of epoxy resin, 10-20 parts of aluminum oxide coated graphene, 5-8 parts of epoxysiloxane coupling agent and 5-10 parts of dibenzyl phosphate; and the component B comprises the following raw materials in parts by weight: 45-65 parts of amino silicon oil, 5-8 parts of aminosilane coupling agent and 10-20 parts of aluminum oxide coated graphene. The epoxy resin and organic silicon composite pouring sealant disclosed by the invention overcomesthe defects of a traditional pouring sealant, has excellent mechanical property, insulation property, sealing property, waterproofness, thermal conductivity, flame retardance, chemical stability andbonding property and is simple and easy to realize pouring-sealing operation.

Description

technical field [0001] The invention relates to the technical field of potting glue, in particular to an epoxy resin and silicone composite potting glue and a preparation method thereof. Background technique [0002] With the development of economy and society, electronic materials and electronic products have sprung up like mushrooms. In order to cooperate with the development of electronic materials and electronic products, people have proposed new methods for the potting adhesive used for bonding, potting and packaging of electronic components. Requirements, not only require it to have excellent mechanical properties, perfect appearance, insulation, sealing, waterproof, but also require it to have good thermal conductivity, flame retardancy, chemical stability, and require its filling operation to be convenient. [0003] At present, there are three main types of potting materials that are widely used, which are epoxy resin, polyurethane and silicone materials. Room temper...

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Problems solved by technology

[0003] At present, there are three main types of potting materials that are widely used, which are epoxy resin, polyurethane and silicone materials. Room temperature curing epoxy resin potting adhesives are widely used in electronic components due to their good mechanical properties and adhesion. However, unmodified epoxy resin has high rigidity, poor toughness under high and low temperature impact, easy cracking of the adhesive layer, and poor dimensional stability caused by thermal expansion and contraction under high and low temperature; silicone materials It has excellent high and low temperature resistance, weather resistance and electrical insulation, but it has the defects of low thermal conductivity, poor flame retardancy and poor bonding performance; polyurethane materials have the best waterproof, acid resistance, flexibility and impact resistance. It is better, but when it is used as an electronic packaging glue, there are more air bubbles, and it needs to be vacuumed and filled, and the operation is more complicated