Automatic sealant pouring device for elements for production of power modules

Abstract

The invention discloses an automatic sealant pouring device for elements for production of power modules. The automatic sealant pouring device for elements for production of power modules comprises apouring mechanism and a fixed heating tank, wherein a vacuum defoaming mechanism is further mounted on the side of the top of the fixed heating tank; the pouring mechanism comprises a sealant injection pump; the bottom of the sealant injection pump is connected with a lifting support in a sleeving manner; a pneumatic valve is mounted at a sealant outlet of the sealant injection pump; a sealant outlet end of the pneumatic valve is connected with a sealant injection tube through a guide tube; the fixed heating tank comprises a heating tank body; electric heating tubes are uniformly mounted on the inner wall of the heating tank body; power supply ends of the electric heating tubes are in parallel connection to an external power supply through wires; the vacuum defoaming mechanism comprises avacuum pump; a sliding supporting plate is mounted on the lower surface of the vacuum pump; two sides of the lower surface of the sliding supporting plate are in bridging connection on the upper surface of the heating tank body; and an air sucking opening of the vacuum pump is connected with a sealing funnel through a sealing guide tube. By heating solidifying, operation time for sealant pouring is shortened, bubbles generated in a pouring process are eliminated, and operation efficiency of sealant pouring and the quality of products are improved.

Description

technical field [0001] The invention relates to the field of power module processing equipment, in particular to an automatic potting glue device for components used in power module production. Background technique [0002] With the development of modern electronic technology and new material technology, high-voltage power supplies are widely used in aerospace and military products, and the requirements for high-voltage power supplies are getting higher and higher. Not only require high power, low ripple, high efficiency, electromagnetic compatibility, etc., but also require high reliability, small size, and light weight. The high-voltage module is potted with silicone gel under vacuum conditions, and finally solidified and formed to realize miniaturization and modularization. It is a key technology to improve insulation, anti-vibration and three-proof characteristics. [0003] At present, the commonly used potting glue is EP3216 power potting glue, which can be stored for ...

AI Technical Summary

Problems solved by technology

[0004] Due to the viscousness of the potting glue, the speed of the glue potting cannot be well controlled during the glue potting operation. There will often be a lot of air mixed in to form air bubbles during the glue potting operation. If these bubbles cannot be completely removed, they will It has a great impact on the electromechanical properties of the power supply; in addition, it takes a long time for the potting compound to cure at room temperature, which cannot meet the needs of industrial production

Images