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Organosilicon material for LED packaging

A technology of LED encapsulation and organic silicon, which is applied in the direction of electrical components, circuits, semiconductor devices, etc., can solve the problems of low light extraction efficiency of chips, achieve excellent resistance to ultraviolet aging and heat aging, improve light transmittance and hardness, and benzene base uniformity effect

Inactive Publication Date: 2018-02-23
SICHUAN KELIXIN NEW MATERIALS CO LTD
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  • Summary
  • Abstract
  • Description
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  • Application Information

AI Technical Summary

Problems solved by technology

Therefore, for power LEDs to be more widely used, the key is to increase their luminous efficiency and luminous flux to the level of existing lighting sources, and the biggest obstacle for power LEDs to obtain high luminous flux is still the low light extraction efficiency of the chip.

Method used

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Experimental program
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Embodiment 1

[0014] A silicone material for LED encapsulation, comprising: A component and B component.

[0015] Component A includes vinyl silicon polymer, olefin-containing polyphenylene phenylene oxide silicone oil and a curing catalyst mixture; wherein the vinyl silicon polymer includes vinyl silicone resin and vinyl-containing polysiloxane; The ratio of the number of Si-C to Si-O in the main chain structure of polyphenylene phenylene ether ethylene silicone oil containing olefin group is 1:1; the particle size of the phosphor used is 6um.

[0016] The B component includes olefin-based hydrogen polyphenylene oxide, vinyl hydrogen-based silicone resin, inhibitor and phosphor. The inhibitor used was methylethynyl alcohol.

[0017] The ratio of vinyl groups to hydrogen groups in components A and B is 1:1.2.

[0018] This embodiment effectively improves the light transmittance and hardness of the crosslinked resin. Moreover, the cured product contains high phenyl content, so it has the ...

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Abstract

The invention discloses a silicone material for LED encapsulation, which is characterized in that it comprises: A component and B component, and the A component includes vinyl silicon high polymer, polyphenylene phenylene ether oxide silicone oil containing olefin group and curing Catalyst Mixture; B Component includes Olefinyl Hydrogen Polyphenylene Phenyl Ether, Vinyl Hydrogen Silicone, Inhibitor and Phosphor. The invention makes the phenyl group in the resin evenly distributed and the resin microstructure uniform through the alternate feeding sequence of the low-functionality siloxane and the high-functionality siloxane, and effectively improves the light transmittance and hardness of the crosslinked resin. Moreover, the cured product contains high phenyl content, so it has the characteristics of high refractive index, high transparency, excellent resistance to ultraviolet aging and thermal aging, and is an ideal packaging material for power LEDs.

Description

technical field [0001] The invention relates to the field of polymer materials, in particular to an organic silicon material for LED packaging. Background technique [0002] In recent years, LED technology and market at home and abroad have developed rapidly. Among them, the luminous efficiency of LED has increased by 100 times, and the cost has dropped by 10 times. Backlight, car combination taillights and interior lighting, etc. [0003] Semiconductor LEDs are used as lighting sources, and the luminous flux of conventional products is far from that of general-purpose light sources such as incandescent lamps and fluorescent lamps. Therefore, for power LEDs to be more widely used, the key is to increase their luminous efficiency and luminous flux to the level of existing lighting sources, and the biggest obstacle for power LEDs to obtain high luminous flux is still the low light extraction efficiency of the chip. At present, the packaging technology of power LEDs also need...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08L83/07C08L83/06C08L83/05H01L33/56
CPCC08L83/04C08L83/06C08L2201/08C08L2201/10C08L2203/206C08L2205/02C08L2205/025C08L2205/035H01L33/56
Inventor 王婷
Owner SICHUAN KELIXIN NEW MATERIALS CO LTD
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