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Double-component selective titanium corrosive liquid and titanium corrosion method

A selective, two-component technology, applied in the field of etchant, can solve the problems such as side erosion and aluminum erosion are not easy to control, graphics accuracy is not ideal, etc., to achieve the effect of prolonging life, stable performance and reducing the amount of side erosion

Active Publication Date: 2018-01-19
JIANGYIN JIANGHUA MICROELECTRONICS MATERIAL
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Due to the reduction potential difference, a galvanic cell is formed between adjacent metal layers, and the corrosion solution is not easy to control the side corrosion of the copper layer and the corrosion of aluminum, which makes the pattern accuracy of the corrosion treatment unsatisfactory.

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0029] Embodiment 1 adopts the composition of embodiment 1 in CN103258727A, and the difference is that strong alkali and weak salt potassium carbonate are added, and the weight percentages of each component of the corrosion solution are respectively: hydrogen peroxide 24.5%, phosphonic acid chelating agent (1-hydroxyl Ethylene-1,1'-diphosphonic acid) 0.5%, copper corrosion inhibitor benzotriazole 0.1%, inorganic base (potassium hydroxide) 2%, potassium carbonate 3% and water 69.9%. Among the above components, inorganic base, potassium carbonate and part of water are used as component A, and hydrogen peroxide, phosphonic acid chelating agent, copper anticorrosion agent and part of water are used as component B.

Embodiment 2

[0031] The difference between Example 2 and Example 1 is that component A includes potassium hydroxide, potassium phosphate and water, wherein the weight percentage of potassium hydroxide is 1%, and the molar ratio of potassium hydroxide to potassium phosphate is 2:1. Component B is hydrogen peroxide, hydrogen peroxide stabilizer sodium polyphosphate and water, the weight percentage of hydrogen peroxide is 35%, and the mixing ratio of component A and component B is 1:2.

Embodiment 3

[0033] The difference between embodiment 3 and embodiment 2 is that component A comprises potassium hydroxide, sodium carbonate and water, wherein the weight percentage of potassium hydroxide is 10%, and the molar ratio of potassium hydroxide and sodium carbonate is 10:1. Component B is hydrogen peroxide, hydrogen peroxide stabilizer sodium polyphosphate and water, the weight percentage of hydrogen peroxide is 28%, and the mixing ratio of component A and component B is 0.9:1.

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Abstract

The invention discloses double-component selective titanium corrosive liquid formed by mixing a component A and a component B before using. The component A is mainly composed of an alkaline water solution, and alkali is at least one of soluble alkali and quaternary ammonium hydroxide. The component B comprises hydrogen peroxide, a hydrogen peroxide stabilizer and water. The component A further comprises strong alkali and weak acid salt, and the weak acid corresponding to the strong alkali and weak acid salt is non-reducing acid. According to the double-component selective titanium corrosive liquid, through adding of the strong alkali and weak acid salt, the concentration of hydroxyl in the corrosive liquid is stabilized, the performance of the corrosive liquid is stable, and the service life of the corrosive liquid can be better prolonged; and through further selection of the strong alkali and weak acid salt, the lateral corrosion amount of a copper layer and erosion of an aluminum layer are effectively reduced, and the etching uniformity is improved.

Description

technical field [0001] The invention relates to the technical field of etching solution, in particular to a two-component selective titanium etching solution and a titanium etching method. Background technique [0002] The requirements of semiconductors for interconnected metal materials include: low resistivity, easy deposition and etching, and good anti-electromigration properties. Aluminum has a low resistivity at room temperature, and the same as n + and p + Silicon has low ohmic contact resistance and is easy to deposit and etch, so it became the earliest interconnect metal material used in integrated circuits. Copper has lower resistance than aluminum-based materials. Therefore, in the prior art, a copper layer is used on the surface of aluminum to make the semiconductor have a higher operating frequency. Further, titanium can also be introduced between the aluminum layer and the copper layer. layer to improve electromigration in semiconductor devices. [0003] In ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C23F1/38
Inventor 李森虎殷福华徐辉赵文虎顾玲燕
Owner JIANGYIN JIANGHUA MICROELECTRONICS MATERIAL
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