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Adaptor board integrated with magnetic core inductor and manufacturing method of adaptor board

A technology of adapter plate and magnetic core, which is applied in semiconductor/solid-state device manufacturing, circuits, electrical components, etc. It can solve the problems of unsuitable miniaturization applications, large package thickness, and large package space, so as to achieve convenient interconnection, Reduce the packaging volume and reduce the effect of packaging

Active Publication Date: 2018-01-09
NAT CENT FOR ADVANCED PACKAGING
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The disadvantage of the magnetic core three-dimensional inductor is that the magnetic core plate and the conductive traces are stacked on the substrate, so that the entire inductor occupies a large package space, resulting in a large thickness of the package, which is not suitable for Miniaturized application

Method used

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  • Adaptor board integrated with magnetic core inductor and manufacturing method of adaptor board
  • Adaptor board integrated with magnetic core inductor and manufacturing method of adaptor board
  • Adaptor board integrated with magnetic core inductor and manufacturing method of adaptor board

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Embodiment Construction

[0036] It should be noted that components in the various figures may be shown exaggerated for the purpose of illustration and are not necessarily true to scale. In the various figures, identical or functionally identical components are assigned the same reference symbols.

[0037] Unless otherwise specified, in this application, the quantifiers "a" and "an" do not exclude the scene of multiple elements.

[0038] figure 1 A cross-sectional view of an interposer board 100 integrating magnetic core inductors according to the present invention is shown.

[0039] like figure 1 As shown, the interposer 100 with integrated magnetic core inductor has a substrate 101 . Substrate 101 is made of silicon, for example. The substrate 101 has grooves 102 . The groove 102 preferably has a rectangular cross-section, so as to provide a larger lateral area when the thickness of the substrate 101 is low, thereby increasing the inductance value.

[0040] A first insulator 103 is arranged at ...

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Abstract

The invention relates to an adaptor board integrated with a magnetic core inductor. The adaptor board comprises a substrate, a first rewiring layer, a second rewiring layer and one or more through holes, wherein a groove is formed in the substrate, a first insulation body is arranged at the bottom of the groove, a ferromagnet is arranged on the first insulation body, a second insulation body is arranged on the ferromagnet, the first rewiring layer is arranged on a first surface of the substrate, a conductive circuit is arranged in the first rewiring layer, the second rewiring layer is arrangedon a second surface, deviating from the first surface, of the substrate, a conductive circuit is arranged in the second rewiring layer, the through holes are filled with metal, two through holes in each pair of through holes are respectively arranged at different sides of the ferromagnet, and the conductive circuit in the first rewiring layer and the conductive circuit in the second rewiring layer are electrically connected by each pair of through holes. The invention also relates to a method for manufacturing the adaptor board.

Description

technical field [0001] The present invention generally relates to the field of semiconductor manufacturing, and in particular relates to an interposer integrated with magnetic core inductors and a method for manufacturing such an interposer. Background technique [0002] As an important passive device, inductors are widely used in filtering, radio frequency matching and other fields. With the trend of miniaturization of electronic equipment, higher and higher requirements are placed on the integration of inductor packages. Air-core coils and magnetic core coils are often used as inductors, but due to the low inductance value of air-core coils, they cannot meet the requirements of many applications, so it is often necessary to use core coils with higher inductance values. How to compactly package the magnetic core coil has also become the focus and difficulty of technicians' research. [0003] The interposer board is also an important device for interconnection in the circu...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L23/498H01L21/48
CPCH01L2224/11
Inventor 李昭强周予虹孙鹏
Owner NAT CENT FOR ADVANCED PACKAGING
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