A kind of LED chip cutting and splitting method

Abstract

The invention provides a method for cutting and splitting an LED chip, which specifically includes: S1 cutting a groove with a preset thickness on the upper surface of the LED chip; S2 splitting along the lower surface of the LED chip to complete the splitting of the LED chip Totally cleaved. After adopting the cutting and splitting method provided by the present invention, the cutting process flow is greatly simplified, and the problems caused by the existing cutting method such as warping of the metal coil and remaining metal residues are effectively solved.

Description

technical field [0001] The invention belongs to the field of semiconductors, and in particular relates to a method for cutting and splitting an LED chip. Background technique [0002] At present, conventional cutting and splitting methods of LED chips include laser cutting, blade cutting and other methods. Among them, in the laser cutting method, the laser is generally used to scribe the front and back surfaces of the LED chip before mechanical splitting; in the blade cutting method, the blade is generally used to cut a certain depth on the front and back surfaces of the LED chip before splitting. . [0003] Using the above method to cut and split the LED chip, although the production speed is high and the cost is low, but in some LED chips with metal back plating, due to the toughness of the metal, if the above conventional method is still used to cut and split it, It will bring a series of problems, such as warped metal rolls, residual metal residue, etc. However, it is...

AI Technical Summary

Problems solved by technology

[0004] Based on the above problems, the object of the present invention is to provide a method for cutting and splitting LED chips, which effectively solves the problems of metal coil warping and residual metal residue caused by the existing splitting method.

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