Substrate leveling equipment and semiconductor fabrication method employing same

Abstract

The invention provides substrate leveling equipment and a semiconductor fabrication method employing the same. The substrate leveling equipment comprises a base, a rotation arm and a disc-shaped assembly, wherein one end of the rotation arm is rotatably connected with the base, the disc-shaped assembly is connected with the other end of the rotation arm, the disc-shaped assembly moves downwards with the rotation of the rotation arm on a vertical plane so that a disc surface of the disc-shaped assembly is laminated and supported on a substrate of a rotation clamping head, and vertical and downward pressure is applied to the substrate so that the substrate is smoothly laminated on the rotation clamping head.

Description

technical field [0001] The invention relates to a substrate flattening device, in particular to a substrate flattening device used in a semiconductor process. Background technique [0002] With the advancement of technology, electronic devices are developing towards miniaturization and precision, which makes the process of semiconductors more complicated. For example, semiconductor substrates need to undergo multiple processes such as grinding, machining, etching, and high-temperature heating to form integrated circuits in electronic devices. In addition, when the substrate is undergoing processes such as cleaning or etching, the substrate is generally fixed on a spin chuck by vacuum adsorption or edge clamping, and the substrate is rotated at a high speed and sprayed on top for cleaning or Etching liquid. [0003] However, after the substrate passes through the above multiple grinding, machining and high temperature processes, the substrate will be deformed due to the inf...

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Problems solved by technology

[0003] However, when the substrate passes through the above multiple grinding, machining and high temperature processes, the substrate will be deformed due to the influence of mechanical force or thermal stress

Especially for thin substrates (such as silicon wafers or glass substrates, etc.), after various processing and high-temperature processes, it is more likely to cause severe deformation of the substrate and cause the substrate to show irregular warpage as a whole.

Therefore, when the warped substrate is undergoing processes such as cleaning or etching, the substrate is not placed flatly on the rotary chuck, thus causing the rotary chuck to fail to smoothly vacuum absorb the substrate through the vacuum chuck to fix it on it.

Or due to the structural interference between the warped edge of the substrate and the jaws of the rotary chuck, the jaws cannot smoothly clamp and fix the substrate on the rotary chuck

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