Anisotropic conductive adhesive tape and adhesive tape roll, binding structure and display apparatus

Abstract

The invention provides an anisotropic conductive adhesive tape and adhesive tape roll, a binding structure and a display apparatus, relates to the technical field of display, and can improve uniformity of the number of conductive particles captured by an electrode, lower risk of poor binding process of a display module, and improve product yield. The anisotropic conductive adhesive tape comprises an insulating adhesive layer and capsule structures scattered in the insulating adhesive layer in preset regions, wherein the insulating adhesive layer comprises multiple preset regions which are arranged at intervals and are corresponding to to-be-bound electrodes; and the capsule structures are used for realizing conductive connection perpendicular to the direction of the adhesive tape surface when the anisotropic conductive adhesive tape suffers from pressure in a direction perpendicular to the adhesive tape surface, wherein the number of the capsule structures in each preset region is greater than a preset number.

Description

technical field [0001] The invention relates to the field of display technology, in particular to an anisotropic conductive tape, a tape roll, a binding structure and a display device. Background technique [0002] Anisotropically Conductive Film (ACF for short) is usually composed of insulating colloid and microcapsules dispersed in the insulating colloid. The microcapsules have a core@shell structure (Core@Shell structure). It is composed of an insulating layer wrapped on the surface of a conductive ball as a shell. When the microcapsules are squeezed perpendicular to the direction of the film surface, the surface insulating layer is ruptured, thereby exposing the internal conductive balls, thereby realizing the directional conductive connection perpendicular to the direction of the film surface. [0003] ACF is widely used in the field of preparation of electronic devices. Taking COG (Chip On Glass, COG for short, refers to the direct binding of the chip to the display p...

AI Technical Summary

Problems solved by technology

[0005] like figure 2 As shown, in the prior art, due to the random arrangement of the microcapsules in the insulating colloid, the distribution of microcapsules in different regions varies greatly, and the number of some regions is large, and the number of other regions is small, so that As a result, the number of conductive balls contacted (that is, captured) by some conductive contacts during bonding is relatively high, as shown in the dotted line box in part (c) of the figure, resulting in a gap between the IC and the relative golden fingers on the Panel. The resistance between the cables is large, the signal conduction is poor, and there is a high risk of poor wiring contact, abnormal display of the module or failure to display the module, which will affect the product yield.

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