Strain loading system for micro-nano material multi-field joint characterization

Abstract

The invention discloses a strain loading system for micro-nano material multi-field joint characterization. A sample stage is fixed to the top end of a base body by spring screws, wherein piezoelectric ceramic is fixed to the upper end of the bottom of the base body, a loading stage is stuck in a metal support groove, a metal support is fixed to a groove in the right side of the sample stage by metal support screws, an electrode pressing sheet is fixed to the upper end of the sample stage, the electrode pressing sheet is in close contact with an electrode on the loading stage to form good electrical contact, a pressure head is fixed in the metal support groove, and the metal support is fixed in the top surface of the piezoelectric ceramic. Strain loading on micro-nano materials in multiple characterization devices is realized; an electrical measurement system has the characteristics of simple structure, reliable performance, simple and convenient installation, convenient operation and wide application scope, can be applied to all one-dimensional or two-dimensional nanomaterials with the length greater than 5 microns, and can be used together with instruments such as various optical microscopes, electron microscopes, spectrometers and synchronous radiometers for multi-field coupling testing.

Description

technical field [0001] The present invention relates to the field of elastic strain research of micro-nano materials, and relates to a method and device for uniaxial strain generation applied to the joint characterization of micro-nano materials with multiple fields (force, electricity, heat, light, etc.), and specifically relates to a microelectronic-based Strain loading system for multi-field characterization of micro-nano materials in mechanical system (MEMS) technology and machining technology. Background technique [0002] John J. Gilman, a world-renowned scholar in the field of material mechanics, explained the theoretical strength of materials (under this stress, the bonds between atoms will be Spontaneous breaking or switching) and drastic electronic structure changes (such as the closing of the semiconductor band gap). Because almost all physical and chemical properties of materials depend on the electronic structure, and the electronic structure must undergo drast...

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Problems solved by technology

But the disadvantages are: 1. The applied strain has been fixed and cannot be changed; 2. In the process of material growth, the dislocation of the substrate will inevitably be introduced into the studied material, resulting in the maximum strain that the target material can bear is limited. Great limitations; 3. This method cannot apply strain to chemically grown one-dimensional or two-dimensional materials; 4. It is difficult to test the electrical properties of target materials

The flexible substrate deformation method uses a flexible substrate instead of the above-mentioned rigid substrate, and the strain range is greatly increased, but the strain state of this method is relatively complicated and the accuracy of the applied strain is low and it is difficult to accurately quantify (Flexible piezoresistive strain sensor based on single Sb-doped ZnOnanobelt, Y.Yang , et al., Applied Physics Letters, 97, 223107, 2010)

[0007] None of the above methods can test and characterize the electrical, optical, and structural properties of micro-nano materials while applying adjustable uniaxial strain to micro-nano materials in a wide range. Strain Engineering Research Requirements

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