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Active heat dissipation mechanism and intelligent wearable equipment

A smart wearable device, active heat dissipation technology, applied in the direction of semiconductor/solid-state device components, semiconductor devices, electrical components, etc., can solve the problems of inability to meet heat dissipation requirements, installation implementation, small installation space, etc., to meet the requirements of miniaturized design Demand, space saving, small footprint effect

Active Publication Date: 2017-11-24
GEER TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

If the traditional heat dissipation method is used, the efficiency is low and cannot meet the heat dissipation requirements
If a thermoelectric cooling chip radiator is used, a thermoelectric material and a heat sink are installed on each chip, which cannot be installed due to high-density integration and small installation space

Method used

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  • Active heat dissipation mechanism and intelligent wearable equipment
  • Active heat dissipation mechanism and intelligent wearable equipment
  • Active heat dissipation mechanism and intelligent wearable equipment

Examples

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Embodiment Construction

[0031] Various exemplary embodiments of the present invention will now be described in detail with reference to the accompanying drawings. It should be noted that the relative arrangements of components and steps, numerical expressions and numerical values ​​set forth in these embodiments do not limit the scope of the present invention unless specifically stated otherwise.

[0032] The following description of at least one exemplary embodiment is merely illustrative in nature and in no way taken as limiting the invention, its application or uses.

[0033] Techniques, methods and devices known to those of ordinary skill in the relevant art may not be discussed in detail, but where appropriate, such techniques, methods and devices should be considered part of the description.

[0034] In all examples shown and discussed herein, any specific values ​​should be construed as exemplary only, and not as limitations. Therefore, other instances of the exemplary embodiment may have dif...

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Abstract

The invention discloses an active heat dissipation mechanism and intelligent wearable equipment. The active heat dissipation mechanism comprises a thermoelectric refrigerating unit, a heat dissipater connected to a thermal terminal of the thermoelectric refrigerating unit, and a heat conduction element. The heat conduction element is configured to conduct heat generated by a plurality of heating elements to a cold terminal of the thermoelectric refrigerating unit. The active heat dissipation mechanism has the following beneficial effects: on the basis of the heat dissipation design, the internal usage space of electronic equipment is saved; and the miniature demand of the electronic equipment is satisfied.

Description

technical field [0001] The invention relates to the technical field of heat dissipation of electronic components, and more specifically, the invention relates to an active heat dissipation mechanism and a smart wearable device. Background technique [0002] With the increasingly powerful functions of electronic consumer products, the power of electronic components such as CPU, GPU, and HPU continues to increase, which leads to an increase in the temperature of the components, which in turn leads to an increase in the local temperature of the entire electronic device, which affects the use of customers. experience. [0003] Elevated temperatures can lead to reduced reliability or even failure of electronic components. Statistics show that 55% of the failures of electronic equipment are caused by excessive temperature, and the famous "10°C rule" supports that: for every 10°C increase in the temperature of semiconductor devices, their reliability will decrease by 50%. [0004...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L23/38
CPCH01L23/38Y02D10/00
Inventor 毛咏发张法亮宋吉智
Owner GEER TECH CO LTD
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