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A kind of copper surface organic acid type super-roughening agent and preparation method thereof

An organic acid and roughening agent technology, used in the field of circuit board treatment agents, can solve the problems of inability to provide sufficient adhesion for thin circuit dry film or solder mask ink, and solder mask to increase adhesion, etc., and achieve micro-roughness. and uniformity improvement, good dry film adhesion, reduced operating costs

Active Publication Date: 2020-06-16
上海天承化学有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The traditional copper surface treatment process cannot provide sufficient adhesion for the fine line dry film or solder mask ink; at the same time, the attack on the solder mask layer by the final metal surface treatment process of PCB also aggravates the severity of the adhesion problem

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0025] The copper surface organic acid type super-roughening agent of the present embodiment, the super-roughening agent uses the buffer solution formed by the neutralization of formic acid and sodium hydroxide as the medium, and takes divalent copper ion as the oxidant, wherein the pH of the buffer solution is 2, The mass concentration of copper ions in the oxidizing agent is 15g / L, and the mass concentration of formic acid is 50g / L.

[0026] The copper surface treated with the copper surface organic acid type super-roughening agent of this embodiment has good roughness and good uniformity. Because the dry film is closely combined with the copper surface, the corners are not lifted, and the amount of dissolved copper can reach 36g / L without any crystallization.

Embodiment 2

[0028] The copper surface organic acid type super-roughening agent of the present embodiment, the super-roughening agent uses the buffer solution formed by the neutralization of formic acid and sodium hydroxide as the medium, and takes divalent copper ions as the oxidant, wherein the pH of the buffer solution is 3, The mass concentration of copper ions in the oxidant is 40g / L, and the mass concentration of formic acid is 80g / L.

[0029] The copper surface treated with the copper surface organic acid type super-roughening agent of this embodiment has good roughness and good uniformity. Because the dry film is closely combined with the copper surface, the corners are not lifted, and the amount of dissolved copper can reach 40g / L without any crystallization.

Embodiment 3

[0031] The copper surface organic acid type super-roughening agent of the present embodiment, the super-roughening agent uses the buffer solution formed by the neutralization of formic acid and sodium hydroxide as the medium, and takes divalent copper ions as the oxidant, wherein the pH of the buffer solution is 3.5, The mass concentration of copper ions in the oxidizing agent is 60g / L, the mass concentration of formic acid is 150g / L, and the super-roughening agent also contains maleic acid, and the mass concentration of maleic acid is 10g / L.

[0032] The copper surface treated with the copper surface organic acid type super-roughening agent of this embodiment has good roughness and good uniformity. Because the dry film is closely combined with the copper surface, the corners are not lifted, and the amount of dissolved copper can reach 50g / L without any crystallization.

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Abstract

The invention provides a copper surface organic acid type super-coarsening agent and a preparation method. The copper surface organic acid type super-coarsening agent adopts a buffer solution prepared by neutralization of organic acid and alkali as the medium and bivalent copper ions as an oxidation agent, wherein the pH value of the buffer solution is 2-4.5, and the mass concentration of the copper ions in the oxidation agent is 15-60 g / L. By means of the copper surface organic acid type super-coarsening agent, the copper soluble amount is remarkably improved and can reach 60 g / L, no crystal separates out, the operation cost is decreased, and the wastewater emission is reduced. The micro-roughness and uniformity of the copper surface are remarkably improved, the optimal coarsened surface can be obtained, the good dry film binding force is obtained, and manufacturing of a fine line is facilitated.

Description

technical field [0001] The invention belongs to the technical field of circuit board treatment agents, and relates to an organic acid type super-roughening agent for copper surfaces and a preparation method thereof. Background technique [0002] PCB (Printed Circuit Board), the Chinese name is printed circuit board, also known as printed circuit board, is an important electronic component, a support for electronic components, and a carrier for electrical connections of electronic components. Because it is made using electronic printing, it is called a "printed" circuit board. [0003] In recent years, with the development of electronic equipment in the direction of lightness, thinness, shortness, and smallness, the same lightness and thinness requirements have also been put forward for PCBs. One of its characteristics is that the lines are becoming more and more dense, and the line width and line spacing are getting smaller and smaller. In addition to the need for high plat...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C23F1/18
CPCC23F1/18
Inventor 王亚君刘江波章晓冬童茂军
Owner 上海天承化学有限公司
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