Giant magnetostictive supersonic vibration polishing device

Abstract

The invention provides a giant magnetostictive supersonic vibration polishing device. The giant magnetostictive supersonic vibration polishing device comprises polishing equipment, a base, a polishing mat, rotary blades and a giant magnetostictive actuator; and the polishing equipment and the base are connected through struts, the polishing mat is arranged on the polishing equipment, the rotary blades are arranged at the bottom of the polishing equipment, and the giant magnetostictive actuator is arranged on the base. According to the giant magnetostictive supersonic vibration polishing device, the driving manner is achieved through the giant magnetostictive actuator, the polishing efficiency can be improved through polishing disc high-frequency vibration, ultraprecise CMP and supersonic vibration composite polishing on crisp and hard semiconductor materials like silicon wafers are achieved, the workpiece surface pressure is reduced, the workpiece surface metamorphic layer thickness is reduced by one time, and the polishing surface quality is improved.

Description

technical field [0001] The invention relates to the technical field of mechanical equipment surface processing, in particular to a giant magnetostrictive ultrasonic vibration polishing device. Background technique [0002] Ultra-precision processing is related to the future development of microelectronics and semiconductor industries. As one of the important technologies in the field of ultra-precision processing, CMP (Chemical Mechanical Polishing) is a method that uses the mechanical and chemical effects of fine abrasive grains to obtain smooth or ultra-fine Processing methods for smooth surface quality. In recent years, researchers have begun to carry out hot research on the surface processing of brittle and hard semiconductor materials such as silicon wafers, especially the use of ultrasonic vibration to assist CMP polishing. [0003] In the existing CMP polishing production operations, some existing problems were found, including high polishing temperature, and mostly ...

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Problems solved by technology

[0003] In the existing CMP polishing production operations, some existing problems were found, including high polishing temperature, and mostly nanoparticles used in the CMP polishing liquid, which have large specific surface area and high surface energy, and are prone to Agglomeration phenomenon, so the abrasive particles are easy to agglomerate and the dispersion effect is generally poor. Not only that, the experiment found that the surface of the workpiece is easy to produce a metamorphic layer, and the quality of the polished surface is poor

There is an urgent need for a device that can solve the problems of high polishing temperature, easy agglomeration of abrasive particles, poor dispersion effect, and poor surface quality. It can reduce the thickness of the metamorphic layer, improve the surface quality, and improve the polishing efficiency. The existing CMP polishing machine does not need to be modified, and can be used in conjunction with the existing CMP polishing machine. The replaceable polishing device can be placed on different polishing machines for CMP polishing.

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