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Wave soldering wave height correction device and correction method

A technology of height correction and wave soldering, which is applied in the direction of auxiliary devices, welding equipment, printed circuit assembly of electrical components, etc., can solve problems affecting soldering quality, unstable wave height, easy deformation of probes, etc., to achieve production efficiency and quality Enhancement, increased stability and reliability, reduced effects of interventions or adjustments

Active Publication Date: 2020-08-28
深圳市阿拉玎光电自动化有限公司
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  • Summary
  • Abstract
  • Description
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AI Technical Summary

Problems solved by technology

[0004] However, the existing technology has the following defects: (1) the probe is easily deformed during use; (2) the top of the probe is easy to stick to tin or other foreign matter, resulting in unstable height detection; Electrode, wire routing is inconvenient in high temperature use
These imperfections can lead to instability in the measured peak heights, which can affect solder quality

Method used

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  • Wave soldering wave height correction device and correction method
  • Wave soldering wave height correction device and correction method
  • Wave soldering wave height correction device and correction method

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Embodiment Construction

[0031] Below, the present invention will be further described in conjunction with the accompanying drawings and specific implementation methods. It should be noted that, under the premise of not conflicting, the various embodiments described below or the technical features can be combined arbitrarily to form new embodiments. .

[0032] like Figure 1-4 As shown, the wave soldering wave height correction device of the present invention includes a tin spraying unit 100, a measuring unit 200, a lifting unit 300 and a control unit.

[0033] The tin spraying unit 100 is used to spray tin liquid at a certain height, and the tin spraying unit 100 can control the height of spraying tin liquid. The measuring unit 200 is used for measuring the height of the tin liquid sprayed by the tin spraying unit 100 . The lifting unit 300 is used to adjust the distance between the measuring unit 200 and the tin spraying unit 100, so as to realize the correction of the peak height. The control un...

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Abstract

The invention discloses a wave soldering crest height correcting device and correcting method. The correcting device comprises a measuring unit, a lifting unit and a control unit, wherein the measuring unit comprises a laser generator and a laser receiver arranged opposite to the laser generator, the laser generator is used for generating a laser beam in a horizontal direction, the lifting unit is used for adjusting the vertical distance between the laser beam and a soldering liquid nozzle of the wave soldering, the control unit is in signal connection with the laser receiver, and the control unit is used for controlling the lifting unit to be opened and closed. According to the device and the method, the crest height of the wave soldering is measured and corrected in a non-contact mode, the defects in the prior art are overcome, and the detection stability is improved.

Description

technical field [0001] The invention relates to the field of circuit board processing and manufacturing equipment, in particular to a wave soldering wave height correction device and correction method. Background technique [0002] In PCB soldering manufacturing, products in high-end application fields will use selective wave soldering for soldering processing. In the selective wave soldering equipment, the control of the peak height is very important, so the detection of the peak height is also particularly important. [0003] The detection method in the prior art is mainly to use a probe or a probe to touch the top of the wave peak, and apply a DC voltage between the wave peak and the probe. When the probe touches the top of the wave peak, a switch-on signal is generated. In this way, Detect peak height. [0004] However, the existing technology has the following defects: (1) the probe is easily deformed during use; (2) the top of the probe is easy to stick to tin or oth...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B23K3/08H05K3/34B23K101/42
CPCB23K3/08B23K2101/42H05K3/34
Inventor 赖国荣刘绕兵朱德银
Owner 深圳市阿拉玎光电自动化有限公司
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