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Solder paste applied to signal distributor and preparation method of solder paste

A signal distributor and solder paste technology, applied in welding equipment, welding medium, manufacturing tools, etc., can solve the problem of no signal distributor solder paste invention patent, etc., to enhance the ability of deoxidation and wetting ability, increase viscosity , the effect of reducing production costs

Inactive Publication Date: 2017-11-03
赛伦(厦门)新材料科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0008] The amount of solder paste used for signal distributors is increasing with the development of production enterprises, but there are no solder paste products and related invention patents specially used for signal distributor welding on the market, so it is specially developed for signal distributor welding. Excellent solder paste is important

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0044] Embodiment 1, a solder paste applied to signal distributors, which is composed of solder paste and tin-based alloy solder powder, raw materials of solder paste: 25% diethylene glycol monohexyl ether, 50% hydrogenated rosin, phenyl Succinic acid 2%, potassium fluoroborate 5%, modified hydrogenated castor oil 8%, antioxidant 264 10%.

[0045]Preparation method: Add the above-mentioned amount of materials into the reaction kettle according to the weight percentage and mix them, stir and heat to 150°C for dissolution, after completely dissolving, place it in the room temperature environment to cool, after cooling to room temperature, use a three-roller grinder to grind, after the grinding is completed Get the solder paste. The solder paste and the tin-based alloy solder powder are mixed and stirred in a mixer at a weight ratio of 15:85, and the solder paste suitable for signal distributor welding is obtained after stirring evenly.

Embodiment 2

[0046] Embodiment 2, a solder paste applied to signal distributors, which is composed of solder paste and tin-based alloy solder powder, raw materials of solder paste: 30% diethylene glycol monooctyl ether, 45% ice white rosin, methyl Succinic acid 4%, sodium fluoroborate 3%, hydrogenated castor oil 9%, antioxidant 245 10%.

[0047] Preparation method: Add the above-mentioned amount of materials into the reaction kettle according to the weight percentage and mix them, stir and heat to 150°C for dissolution, after completely dissolving, place it in the room temperature environment to cool, after cooling to room temperature, use a three-roller grinder to grind, after the grinding is completed Get the solder paste. The solder paste and the tin-based alloy solder powder are mixed and stirred in a mixer at a weight ratio of 14:86, and the solder paste suitable for signal distributor welding is obtained after stirring evenly.

Embodiment 3

[0048] Embodiment 3, a solder paste applied to signal distributors, which is composed of solder paste and tin-based alloy solder powder, raw materials of solder paste: 2-ethyl-1, 3-hexanediol 35%, water white Rosin 48%, p-tert-butylbenzoic acid 3%, zinc fluoroborate 2%, ethylene bis-stearamide 7%, antioxidant 1010 10%.

[0049] Preparation method: Add the above-mentioned amount of materials into the reaction kettle according to the weight percentage and mix them, stir and heat to 150°C for dissolution, after completely dissolving, place it in the room temperature environment to cool, after cooling to room temperature, use a three-roller grinder to grind, after the grinding is completed Get the solder paste. The solder paste and the tin-based alloy solder powder are mixed and stirred in a mixer at a weight ratio of 13:87, and the solder paste suitable for signal distributor welding is obtained after stirring evenly.

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PUM

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Abstract

The invention relates to solder paste applied to a signal distributor. The solder paste is composed of flux paste and tin-based alloy welding powder. The flux paste is obtained after 25%-40% of solvent, 42%-50% of modified rosin, 2%-5% of organic acid, 2%-5% of borofluoride, 7%-10% of a thixotropic agent and 5%-10% of an antioxidant are added in a reaction kettle to be stirred, heated to 150 DEG C and dissolved. The flux paste is evenly mixed with any one of several types of solder powder, including Sn96.5Ag3.0Cu0.5, Sn97.5Ag2.0Cu0.5, Sn98.5Ag1.0Cu0.5, Sn99Ag0.3Cu0.7, Sn99Cu0.7, Sn42Bi58, Sn64Bi35Ag1.0, Sn64.7Bi35Ag0.3 and Sn64.9Bi35Ag0.1, in a mixing machine according to the weight ratio being (10-15):(85-90) to obtain the solder paste suitable for the signal distributor. The solder paste is particularly suitable for the signal distributor, the production cost can be reduced, and the production efficiency can be improved; viscosity is appropriate, thixotropy is high, the solder paste is not likely to be layered when a glue dispenser conducts dispensing, and the solder paste can be uniformly sprayed on an assigned welding area; an oxidation film of an electroplated coating on the surface of the solder powder can be completely removed within 5-8 seconds, and false solder and missing solder can be prevented; and the storage life of the solder paste is long, and the solder paste can bear a high welding temperature. Post-soldering residues are few, and cleaning can be easily conducted through an environment-friendly cleaning agent.

Description

technical field [0001] The invention relates to the technical field of solder paste, in particular to a solder paste used for welding signal distributors and a preparation method thereof. Background technique [0002] Surface mount technology (SMT for short), which began in the 1970s, refers to printing solder paste on the pads of printed circuit boards, and attaching surface mount components to solder paste printed with solder paste. On the plate, heat the circuit board according to a specific reflow temperature curve (usually the total soldering time is 5 to 6 minutes), let the solder paste melt, and the alloy components are cooled and solidified to form solder joints between the components and the printed circuit board. Techniques for achieving metallurgical connections. [0003] Solder paste is a new type of soldering material that accompanies SMT. Solder paste is a paste made of solder powder, flux and other additives. Solder paste has a certain viscosity at room tem...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B23K35/363B23K35/26H05K3/34B23K35/40
CPCB23K35/025B23K35/262B23K35/3612B23K35/362B23K35/40H05K3/341H05K3/3485
Inventor 韩惠琴
Owner 赛伦(厦门)新材料科技有限公司
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