Smart card middle material manufacturing method and middle material structure

A manufacturing method and smart card technology, applied in the field of smart cards, can solve problems such as easy unevenness of the middle material, easy glue-in, and easy damage of keys, and achieve the effect of solving the unevenness of the middle layer, solving the problem of process compatibility, and enhancing flexibility

Active Publication Date: 2021-08-06
HIERSTAR (SUZHOU) LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The flatness of the electronic module is completely dependent on the glue filling, the toughness is poor, it is easy to be damaged and deformed, and the keys are easy to glue
The flatness is difficult to guarantee, the middle material is easy to be uneven, and it is difficult to paste holographic labels and signature strips

Method used

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  • Smart card middle material manufacturing method and middle material structure
  • Smart card middle material manufacturing method and middle material structure
  • Smart card middle material manufacturing method and middle material structure

Examples

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Embodiment Construction

[0035] In order to make the above objects, features and advantages of the present invention more comprehensible, specific implementations of the present invention will be described in detail below in conjunction with the accompanying drawings.

[0036] In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present invention. However, the present invention can be implemented in many other ways different from those described here, and those skilled in the art can make similar extensions without violating the connotation of the present invention, so the present invention is not limited by the specific implementations disclosed below.

[0037] The invention can be used to make video cards. Visual card (also known as: visual copy card, easy-view card, rewrite card, rewrite card, digital copy card, Windows IT card, heat-sensitive copy card, thermal magnetic stripe card, etc.), is a heat-sensitive material Made of br...

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Abstract

The invention proposes a method and a structure for making the middle material of a smart card. A transparent sheet is used to make an electronic module patch panel, and keyholes corresponding to the buttons of the electronic module and corresponding to electronic module components are formed on the transparent sheet. punching holes, and attach a key protection film to the button holes to prevent the keys from being exposed after the smart card is made; The reinforced electronic module is reinforced, and then the reinforced electronic module is embedded in the middle material frame to form the middle material structure. Since the electronic module is firstly filled and leveled, and embedded in the material shell of the video card, the problem of compatibility between the video card and the ordinary card process is effectively solved; the unevenness of the middle layer caused by the shrinkage of the glue after traditional gluing is solved The problem of unevenness; the flexibility of the card is enhanced, the amount of glue applied is reduced, and many difficult problems such as labeling / sticking button glue feeding are solved.

Description

technical field [0001] The invention relates to smart card technology, in particular to a manufacturing method and structure of a middle material for a smart card. Background technique [0002] Smart Card (SmartCard), a general term for a plastic card (usually the size of a credit card) embedded with a microchip, such as a visual card. The middle layer or middle material structure of the smart card has an electronic module, and in some smart cards, the electronic module is generally a flexible electronic module. [0003] The invention patent application document published by the Chinese Patent Office (the publication number is CN104527202A) discloses a method for manufacturing the middle layer of a card, which is a brand-new method for manufacturing the middle layer of a card at low temperature and low pressure. The method first makes the lower layer of the middle layer and the upper layer of the middle layer, Bonding constitutes the middle material shell, and then prepares...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G06K19/07G06K19/077
CPCG06K19/0702G06K19/07707G06K19/07722
Inventor 万天军刘超赵晓青黄小辉
Owner HIERSTAR (SUZHOU) LTD
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