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Method of evaluating glass substrate heat shrinkage

A glass substrate, thermal shrinkage technology, applied in the direction of material thermal expansion coefficient, measuring device, instrument, etc., can solve the problem of not measuring the thermal shrinkage of the whole board, uneven thermal shrinkage, etc., achieve good application prospects, simplify the evaluation process, shorten the evaluation process effect of time

Active Publication Date: 2017-10-03
DONGXU OPTOELECTRONICS TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

For the large-size glass substrates currently on the market, such as the 5th generation line (1100mm×1250mm) and the 10th generation line (2880mm×3080mm), there is no method to measure the thermal shrinkage of the whole board, especially in the two coordinate directions of X and Y. The difference in shrinkage rate; at the same time, because there is a certain degree of thermal shrinkage inhomogeneity in large-size glass substrates, a reliable method is required to measure different areas

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  • Method of evaluating glass substrate heat shrinkage
  • Method of evaluating glass substrate heat shrinkage
  • Method of evaluating glass substrate heat shrinkage

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0087] This example is used to illustrate the method for evaluating thermal shrinkage of a glass substrate provided by the present invention.

[0088] (1) Preparation of the bottom plate

[0089] According to the size of the glass substrate to be tested (TFT-LCD G4 0.5mm glass substrate, purchased from Corning, size 830mm×650mm), prepare a rectangular bottom plate that is larger than the glass substrate and made of plastic, and mark the center of the bottom plate with a laser dotting instrument The origin O' in the form of a cross, and then use the laser scriber to calibrate the mutually perpendicular X-axis and Y-axis through the origin O', and divide the strip-tested glass substrate into four areas, where the X-axis is parallel to the long side of the bottom plate, And divide the X axis and Y axis into equal parts respectively to form a grid on the base plate. The grid is rectangular, its length and width are both 200mm, and an intersection point of the grid is used as the ...

Embodiment 2

[0108] This example is used to illustrate the method for evaluating shrinkage of a glass substrate provided by the present invention.

[0109] Carry out according to the method for embodiment 1, the difference is that the glass substrate to be tested is a TFT-LCD G6 0.4mm glass substrate (purchased from Corning Corporation, size 1800mm * 1500mm), and correspondingly select the glass substrate with a size larger than the glass substrate to be tested. Plastic bottom plate; in step (1), grid is rectangular, and its length is 500mm, and width is 300mm; Raise the temperature to 400°C, keep it warm for 40s, then cool down to 250°C at a cooling rate of 50°C / min, and air-cool to room temperature (25°C).

[0110] Mark a coordinate point in each of the four areas of the base plate (respectively A’ 5 、A' 6 、A' 7 and A' 8 ), respectively corresponding to four test points on the glass substrate to be tested (respectively A 5 、A 6 、A 7 and A 8 ), according to the above method and ca...

Embodiment 3

[0114] This example is used to illustrate the method for evaluating shrinkage of a glass substrate provided by the present invention.

[0115] Carry out according to the method of embodiment 1, the difference is that the glass substrate to be tested is a TFT-LCD G8.5 0.5mm glass substrate (purchased from Corning, size 2500mm × 2200mm), and the corresponding size is selected to be larger than the glass to be tested. The plastic bottom plate of substrate; In step (1), grid is rectangular, and its length is 500mm, and width is 400mm; In step (2), the condition of heat treatment is: with the heating rate of 50 ℃ / min, by room temperature ( 25°C) to 600°C, keep the temperature for 60s, then cool down to 250°C at a cooling rate of 60°C / min, and air cool to room temperature (25°C).

[0116] Mark a coordinate point in each of the four areas of the base plate (respectively A’ 9 、A' 10 、A' 11 and A' 12 ), respectively corresponding to the four points to be measured on the glass subst...

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Abstract

The invention relates to the field of glass, and discloses a method of evaluating glass substrate heat shrinkage. The method comprises the following steps: by adopting a coordinate axis calibration manner and matching with determination of a delta alpha axis representing an axial shrinkage ratio difference, an alpha surface representing a surface shrinkage ratio and an alpha line index representing a linear shrinkage ratio, comprehensive evaluation on the heat shrinkage condition of a glass substrate is realized. Particularly, by adopting a mesh generation manner, the heat shrinkage condition of each region of the glass substrate can be more intuitively observed and analyzed, so that reflection of the uneven heat shrinkage problem of the glass substrate and contrastive analysis among different glass substrates are more facilitated.

Description

technical field [0001] The invention relates to the field of glass, in particular to a method for evaluating thermal shrinkage of a glass substrate. Background technique [0002] In recent years, portable electronic products such as notebook computers, tablet computers, smart phones, and smart wearable devices have become popular rapidly, and liquid crystal display (LCD) products with characteristics such as thinness, lightness, high resolution, and high image quality are popular among the public. Glass substrate is an important part of LCD. With the development of LCD technology, higher and higher requirements are put forward for the performance of glass substrate materials. For example, in the active matrix liquid crystal display, the thin film transistor and the color filter layer are directly formed on the glass substrate through multiple heating and photolithography processes. In order to ensure the proper overlap of multiple photolithography processes, the thermal stab...

Claims

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Application Information

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IPC IPC(8): G01N25/16G01B11/02
CPCG01B11/02G01N25/16
Inventor 王肖义张广涛李媚寰周波闫冬成王丽红郑权王博
Owner DONGXU OPTOELECTRONICS TECH CO LTD
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