Two-component polyaspartate urea rigid adhesive and its use and application
A technology of aspartic acid ester and tetraethyl aspartic acid ester, applied in the direction of polyurea/polyurethane adhesive, adhesive, adhesive type, etc., can solve the problems of strict construction requirements, poor construction performance, and low construction efficiency , to achieve good UV aging resistance, resistance to sunlight, and firm bonding of aggregates
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
Method used
Image
Examples
Embodiment 1
[0024] Example 1 This example discloses a two-component polyaspartate urea rigid adhesive, the adhesive components are as follows:
[0025] A component formula:
[0026] 90.2 parts by weight of N,N'-(methylene di-4,1-cyclohexanediyl) diaspartic acid tetraethyl ester;
[0027]
[0028]
[0029] Component B is equal to component A, including trimer curing agent Bayer 3900, HMDI modified curing agent and IPDI modified curing agent, and the weight ratio of the three is 22:38:40.
[0030] Among them, the HMDI modified curing agent is synthesized by adding 100g of HMDI, dropwise adding 75g of PCL500, controlling the temperature at 80°C for 4hrs, then raising the temperature to 90°C for 4hrs, and detecting the NCO content: 11.1% and discharging.
[0031] The IPDI modified curing agent is 100g of IPDI, and 225g of PPG1000 is added dropwise to react until the NCO content is 5.8%.
[0032] This embodiment also discloses the use method of the two-component polyaspartic ester urea...
Embodiment 2
[0034] Example 2 This example discloses a two-component polyaspartate urea rigid adhesive, the adhesive components are as follows:
[0035] A component formula:
[0036] 90.2 parts by weight of N,N'-(methylene di-4,1-cyclohexanediyl) diaspartic acid tetrabutyl ester;
[0037]
[0038] Component B is equal to component A, including trimer curing agent Bayer 3900 and HMDI modified curing agent, the weight ratio of the two is 22:78;
[0039] The HMDI modified curing agent is synthesized by adding 100g of HMDI dropwise with 100g of PPG2000 and 60g of PPG400 under temperature control until the NCO content is 6.2%.
[0040] This embodiment also discloses the use method of the two-component polyaspartic ester urea rigid adhesive, and the steps of the method are as follows: mix the A component and the B component according to the corresponding parts by weight Stir evenly, trowel and apply on the asphalt surface with a thickness of 1-1.5mm, then quickly spread the wear-resistant a...
Embodiment 3
[0042] Example 3 This example discloses a two-component polyaspartate urea rigid adhesive, the adhesive components are as follows:
[0043] A component formula:
[0044] 80 parts by weight of N,N'-(methylene bis-(1-methyl,-4,1-cyclohexanediyl)) diaspartic acid tetraethyl ester;
[0045]
[0046] The same amount of component B and component A, including trimer curing agent Bayer 3900 and HMDI modified curing agent, the weight ratio of the two is 10:90;
[0047] The HMDI modified curing agent is synthesized by adding 100g of HMDI dropwise with 100g of PPG2000 and 60g of PPG400 under temperature control until the NCO content is 15%.
[0048] This embodiment also discloses the use method of the two-component polyaspartic ester urea rigid adhesive, and the steps of the method are as follows: mix the A component and the B component according to the corresponding parts by weight Stir evenly, trowel and apply on the asphalt surface with a thickness of 1-1.5mm, then quickly spread...
PUM
Property | Measurement | Unit |
---|---|---|
thickness | aaaaa | aaaaa |
particle diameter | aaaaa | aaaaa |
Abstract
Description
Claims
Application Information
- R&D Engineer
- R&D Manager
- IP Professional
- Industry Leading Data Capabilities
- Powerful AI technology
- Patent DNA Extraction
Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.
© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com