Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Composition for joining and electronic component joint

A composition and inorganic particle technology, applied in the direction of electrical components, circuits, semiconductor devices, etc., can solve the problems of hindering LED light emission, not considering the formation of solder joints, difficult luminous intensity, etc., and achieve the suppression of solder joint formation and dispersion Good effect of preventing fluidity from becoming too high

Active Publication Date: 2021-01-01
BANDO CHEM IND LTD
View PDF1 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

More specifically, if a fillet is formed in the junction, the light emission of the LED is hindered by the fillet, and it is difficult to maintain the luminous intensity for a long time due to the discoloration of the fillet over time.
However, in the joining material described in the above-mentioned Patent Document 1, the formation of the above-mentioned nugget is not considered at all.

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Composition for joining and electronic component joint

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0150] 0.60 g of dodecylamine (reagent grade 1 manufactured by Wako Pure Chemical Industries (KK)), 7.0 g of hexylamine (reagent grade 1 manufactured by Wako Pure Chemical Industries (KK)), and butylamine (reagent grade 1 manufactured by Wako Pure Chemical Industries Ltd. (Co., Ltd.) Reagent grade 1) 3.0 g was mixed, and fully stirred with a magnetic stirrer. Here, while stirring, 7.0 g of silver oxalate (a reagent special grade manufactured by Toyo Chemical Industry Co., Ltd.) was added to thicken the mixture.

[0151] Next, the obtained viscous substance was put into a thermostat at 110° C., and reacted for about 10 minutes. In order to replace the dispersion medium of the suspension after the reaction, 10 ml of methanol (reagent grade 1 manufactured by Wako Pure Chemical Industries, Ltd.) was added to the suspension, stirred, and the silver fine particles were precipitated by centrifugation. For separation, 10 ml of methanol (reagent grade 1 manufactured by Wako Pure Chemi...

Embodiment 2

[0164] A composition for bonding was prepared in the same manner as in Example 1, except that the dispersion medium was 0.15 g of terpineol dihydroacetate and 0.1 g of 1-decanol (a reagent grade manufactured by Wako Pure Chemical Industries, Ltd.). 2, and various characteristics were evaluated in the same manner as in Example 1. The obtained results are shown in Table 1.

Embodiment 3

[0166] Composition 3 for jointing was prepared in the same manner as in Example 1, except that the dispersion medium was 0.15 g of terpineol dihydroacetate and 0.1 g of Terusolve MTPH (manufactured by Nippon Terpene Co., Ltd.). , and various characteristics were evaluated in the same manner as in Example 1. The obtained results are shown in Table 1.

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

PropertyMeasurementUnit
particle sizeaaaaaaaaaa
particle sizeaaaaaaaaaa
heightaaaaaaaaaa
Login to View More

Abstract

The present invention provides a bonding composition and an electronic component bonding body, which can obtain high bonding strength by bonding at a relatively low temperature, maintain sufficient spread toward the interface to be bonded, and suppress formation of solder joints. The invention provides a composition for bonding, which includes inorganic particles and organic components: the average particle diameter of the inorganic particles is 1nm to 200nm, and at a shear rate of 10s ‑1 The viscosity at approximately 25°C is 10Pa·s~30Pa·s, and at a shear rate of 1s ‑1 The viscosity at approximately 25°C when measured under is divided by the shear rate of 10s ‑1 The thixotropic ratio defined by the value obtained by the viscosity at approximately 25°C at the time of measurement is 3-7.

Description

technical field [0001] The present invention relates to a bonding composition and an electronic component bonded body comprising inorganic particles as a main component and an organic component as a subcomponent. Background technique [0002] In order to mechanically, electrically, and / or thermally join metal parts to metal parts, solder, conductive adhesives, silver pastes, anisotropic conductive films, and the like have been used conventionally. These conductive adhesives, silver pastes, anisotropic conductive films, and the like are used not only when joining metal parts but also when joining ceramic parts, resin parts, and the like. For example, bonding of a light emitting element such as a light emitting diode (Light Emitting Diode, LED) to a substrate, bonding of a semiconductor chip to a substrate, bonding of these substrates to a heat dissipation member, and the like are exemplified. [0003] Among them, adhesives, pastes, and films containing solder and conductive ...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Patents(China)
IPC IPC(8): C09J1/00C09J9/02H01B1/22H01L21/52H01L33/48
CPCC09J9/02H01B1/22H01L33/48C09J11/04C08K9/04C08K2201/005C08K2201/011
Inventor 中岛尚耶松居美纪下山贤治
Owner BANDO CHEM IND LTD
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com