A variable-pitch double-helix air-cooling device suitable for water-soluble silk
An air-cooled device and double-helix technology, applied in the field of variable-pitch double-helix air-cooled devices, can solve problems such as easy blowing of the wire, poor stability of wire roundness and wire diameter, long process response time, etc., to improve The effect of roundness accuracy and wire diameter stability, avoiding stress deformation or cracking, and a wide range of gas sources
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Embodiment 1
[0040] The variable-pitch double-helix air-cooling device suitable for water-soluble filaments provided in Example 1 includes two air-cooling mechanisms and one guide roller 7, the two air-cooling mechanisms are relatively spaced apart, and the guide roller 7 is located at In the middle of the two air-cooling mechanisms, it is used to accept the water-soluble silk from one of the two air-cooling mechanisms into the other air-cooling mechanism to realize the two-stage cooling of the water-soluble silk. cool down. In this embodiment, the lengths of the two air-cooling mechanisms along the moving direction of the water-soluble wire are 4 meters and 5 meters respectively; the diameter of the through hole 3 is 10 mm.
Embodiment 2
[0042] The variable-pitch double-helix air-cooling device applicable to the water-soluble wire material provided by embodiment 2 is basically the same as the variable-pitch double-helix air-cooling device applicable to the water-soluble wire material provided by embodiment 1, the difference is that the air cooling device of embodiment 2 The cooling device can realize the three-stage cooling of the water-soluble wire, and the air cooling device includes 3 relatively spaced air cooling mechanisms and two guide rails 7, and the two guide rails 7 are separated from the three air cooling mechanisms. It is provided that the lengths of the three air-cooling mechanisms along the moving direction of the water-soluble filament are 2 meters, 3 meters and 4 meters respectively; the diameter of the through hole 3 is 30 mm.
Embodiment 3
[0044] The variable-pitch double-helix air-cooling device applicable to water-soluble wire provided by embodiment 3 is basically the same as the variable-pitch double-helix air-cooled device applicable to water-soluble wire provided by embodiment 1, the difference is that the air cooling device of embodiment 3 The through hole 3 of the cold device has a diameter of 50 mm.
[0045] The variable-pitch double-helix air-cooling device suitable for water-soluble wire provided by the present invention is provided with a variable-pitch double-helix spoiler, and the variable-pitch double-helix spoiler makes the gas passing through form a double-helix annular airflow, double The spiral annular airflow surrounds the wire to cool the wire evenly. The volume of the semi-solid wire shrinks evenly along the radial direction. At the same time, the double helical annular airflow supports the wire and prevents the wire from appearing Slumping phenomenon.
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