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A variable-pitch double-helix air-cooling device suitable for water-soluble silk

An air-cooled device and double-helix technology, applied in the field of variable-pitch double-helix air-cooled devices, can solve problems such as easy blowing of the wire, poor stability of wire roundness and wire diameter, long process response time, etc., to improve The effect of roundness accuracy and wire diameter stability, avoiding stress deformation or cracking, and a wide range of gas sources

Active Publication Date: 2019-02-12
GUANGDONG SILVER AGE SCI & TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The liquid cooling method is easy to operate, has a good cooling effect, and the wire diameter is stable and easy to control. However, other substances are easy to remain on the surface, and the surface appearance quality is not good enough. Long-term production needs to add liquid. If organic solutions are used, there will be safety hazards; The source of the cooling medium is easy, but due to its low heat transfer coefficient, the cooling speed of the traditional air cooling method is slow, the process response time is long, and the cooling effect is not ideal. For example, the traditional air cooling method is directly above or below the wire. Cooling by the cooling fan, the upper and lower sides of the wire are cooled unevenly, resulting in poor stability of the roundness and wire diameter of the wire, and the wire is easy to be blown off

Method used

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  • A variable-pitch double-helix air-cooling device suitable for water-soluble silk
  • A variable-pitch double-helix air-cooling device suitable for water-soluble silk
  • A variable-pitch double-helix air-cooling device suitable for water-soluble silk

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Experimental program
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Effect test

Embodiment 1

[0040] The variable-pitch double-helix air-cooling device suitable for water-soluble filaments provided in Example 1 includes two air-cooling mechanisms and one guide roller 7, the two air-cooling mechanisms are relatively spaced apart, and the guide roller 7 is located at In the middle of the two air-cooling mechanisms, it is used to accept the water-soluble silk from one of the two air-cooling mechanisms into the other air-cooling mechanism to realize the two-stage cooling of the water-soluble silk. cool down. In this embodiment, the lengths of the two air-cooling mechanisms along the moving direction of the water-soluble wire are 4 meters and 5 meters respectively; the diameter of the through hole 3 is 10 mm.

Embodiment 2

[0042] The variable-pitch double-helix air-cooling device applicable to the water-soluble wire material provided by embodiment 2 is basically the same as the variable-pitch double-helix air-cooling device applicable to the water-soluble wire material provided by embodiment 1, the difference is that the air cooling device of embodiment 2 The cooling device can realize the three-stage cooling of the water-soluble wire, and the air cooling device includes 3 relatively spaced air cooling mechanisms and two guide rails 7, and the two guide rails 7 are separated from the three air cooling mechanisms. It is provided that the lengths of the three air-cooling mechanisms along the moving direction of the water-soluble filament are 2 meters, 3 meters and 4 meters respectively; the diameter of the through hole 3 is 30 mm.

Embodiment 3

[0044] The variable-pitch double-helix air-cooling device applicable to water-soluble wire provided by embodiment 3 is basically the same as the variable-pitch double-helix air-cooled device applicable to water-soluble wire provided by embodiment 1, the difference is that the air cooling device of embodiment 3 The through hole 3 of the cold device has a diameter of 50 mm.

[0045] The variable-pitch double-helix air-cooling device suitable for water-soluble wire provided by the present invention is provided with a variable-pitch double-helix spoiler, and the variable-pitch double-helix spoiler makes the gas passing through form a double-helix annular airflow, double The spiral annular airflow surrounds the wire to cool the wire evenly. The volume of the semi-solid wire shrinks evenly along the radial direction. At the same time, the double helical annular airflow supports the wire and prevents the wire from appearing Slumping phenomenon.

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Abstract

The invention belongs to the field of advanced manufacturing related technology and discloses a varying pitch double-spiral air cooling device suitable for water-soluble wires. The varying pitch double-spiral air cooling device comprises at least one air cooling mechanism arranged sequentially oppositely at intervals, so that multi-section type continuous cooling of the water-soluble wires is achieved. Each air cooling mechanism comprises an air cover and a varying pitch double-spiral spoiler arranged in the air cover. Each varying pitch double-spiral spoiler is provided with a through hole, and the water-soluble wires penetrate through the through holes. Wire inlets and wire outlets which communicate with the two ends of the through holes correspondingly are formed in the two opposite ends of the air covers correspondingly. Through the varying pitch double-spiral spoilers of the varying pitch double-spiral air cooling device, cooing airflow forms spiral airflow, the spiral airflow surrounds the wires to cool the wires evenly, the sizes of the semisolid wires shrink evenly in the radial direction, meanwhile, the spiral airflow achieves a supporting function on the wires, and the downward collapse phenomenon of the wires due to gravity is prevented.

Description

technical field [0001] The invention belongs to the technical field related to advanced manufacturing, and more specifically relates to a variable-pitch double-helix air cooling device suitable for water-soluble wire. Background technique [0002] Fused Deposition Modeling (Fused Deposition Modeling, FDM) is one of the most widely used 3D printing technologies at present. It uses thermoplastic polymer materials as raw materials, extrudes semi-solid fuses through melt nozzles, and builds layers directly from CAD models. 3D solid components. [0003] In general, when forming a cantilever structure by FDM, it is usually necessary to add temporary support to prevent the main body forming material from hanging and collapsing. FDM support materials are mainly divided into two categories: peeling support and water (alkaline or acidic medium) soluble support. For peeling supports, the shape of the formed part may leave surface damage due to the peeling of the support. The water-s...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B29C48/88
CPCB29C48/05B29C48/911
Inventor 闫春泽陈鹏史玉升傅轶汪艳魏青松刘洁
Owner GUANGDONG SILVER AGE SCI & TECH CO LTD
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