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Micro-etching treatment process and equipment for shiny surface of copper foil

A technology of processing technology and processing equipment, which is applied in the field of copper foil, can solve problems such as blistering, low adhesion, and large coarsened particles of copper foil, and achieve the effects of increasing specific surface area, improving bonding force, and low etching factor

Active Publication Date: 2017-08-29
建滔(连州)铜箔有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] Although the process and technology for copper foil treatment are disclosed in the prior art, there are still many deficiencies. The existing copper foil smooth surface treatment is to carry out pickling, roughening, curing, and corrosion resistance on the flat copper foil smooth surface. It is made by a series of treatments such as thermal layer treatment, anti-oxidation and coating of coupling agent. The coarsened particles of the prepared copper foil are relatively large and the surface area is small. The strength is low, and the printed circuit board made of low-adhesion copper foil is easy to cause bad phenomena such as blistering, line throwing and delamination, which seriously affects the quality of the circuit board. The traditional glossy copper foil and such a board It is difficult to meet its requirements because of its low adhesion. Therefore, a copper foil smooth surface micro-turbidity treatment process and equipment are proposed to solve the problem of low bonding force between the surface-treated copper foil and the substrate.

Method used

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  • Micro-etching treatment process and equipment for shiny surface of copper foil
  • Micro-etching treatment process and equipment for shiny surface of copper foil
  • Micro-etching treatment process and equipment for shiny surface of copper foil

Examples

Experimental program
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Effect test

Embodiment 1

[0038]Slowly stir the sulfuric acid and water to make the concentration reach 300g / L, and the temperature is 60°C. The temperature will increase after the contact between water and sulfuric acid, so pay attention to the temperature during the stirring process to prevent danger caused by excessive temperature. The stirring time is 2min. Cool the mixture of water and sulfuric acid in the liquid storage tank 2, the cooling temperature is 20°C, and the cooling time is 3 minutes, then add hydrogen peroxide and hydrochloric acid into the liquid storage tank 2, the concentration of hydrogen peroxide is 90g / L, and the concentration of hydrochloric acid is 40g / L, the mixture of hydrogen peroxide and hydrochloric acid, water and sulfuric acid in the storage tank 2 will form a slightly turbid liquid after dissolution, the temperature is 30°C, the slightly turbid liquid is pumped to the filter 4, and the micro turbid liquid filtered by the filter 4 The turbid liquid flows into the spray pi...

Embodiment 2

[0040] Slowly stir the sulfuric acid and water to make the concentration reach 350g / L, the temperature is 70°C, the temperature will increase after the contact between water and sulfuric acid, so pay attention to the temperature during the stirring process, to prevent the danger caused by excessive temperature, the stirring time is 3min, Cool the mixture of water and sulfuric acid in the liquid storage tank 2, the cooling temperature is 22°C, and the cooling time is 8 minutes, then add hydrogen peroxide and hydrochloric acid into the liquid storage tank 2, the concentration of hydrogen peroxide is 80g / L, and the concentration of hydrochloric acid is 30g / L, the mixture of hydrogen peroxide and hydrochloric acid, water and sulfuric acid in storage tank 2, dissolves to form a slightly turbid liquid, the temperature is 30°C, the slightly turbid liquid is pumped to the filter 4, and the micro turbid liquid filtered by the filter 4 The turbid liquid flows into the spray pipe 7, the c...

Embodiment 3

[0042] Add water into the liquid storage tank 2, then add sulfuric acid into the liquid storage tank 2 and stir. The concentration of sulfuric acid is 330g / L, and the temperature is 66°C. The temperature will increase after the contact between water and sulfuric acid, so pay attention to the temperature during the stirring process To prevent danger caused by excessive temperature, cool the mixture of water and sulfuric acid in the liquid storage tank 2, the cooling temperature is 33°C, and the cooling time is 7 minutes, then add hydrogen peroxide and hydrochloric acid into the liquid storage tank 2, the hydrogen peroxide concentration The concentration of hydrochloric acid is 75g / L, the concentration of hydrochloric acid is 36g / L, the mixture of hydrogen peroxide and hydrochloric acid, water and sulfuric acid in storage tank 2 will form a slightly turbid liquid after dissolution, the temperature is 32°C, and the slightly turbid liquid is pumped to filter 4 , the slightly turbid...

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Abstract

The invention discloses a micro-etching treatment process and equipment for a shiny surface of a copper foil. The process comprises the following steps: adding water into a liquid storage groove, adding 100g / L-400g / L sulfuric acid with a temperature of 10-80 DEG C into the liquid storage groove, cooling mixed liquid of water and sulfuric acid in the liquid storage groove to 10-50 DEG C, adding 50g / L-100g / L hydrogen peroxide and 20g / L-50g / L hydrochloric acid into the liquid storage groove, dissolving hydrogen peroxide, hydrochloric acid, water and sulfuric acid to obtain micro-etching liquid with a temperature of 10-50 DEG C, carrying out micro-etching on the shiny surface of the copper foil by virtue of a micro-etching process and equipment so as to generate an uneven shape, so that the specific surface area of the copper foil is increased; and carrying out treatments of solidification, heat-proof layer treatment, oxidation prevention and coupling agent coating, so that the bonding force between the shiny surface-treated copper foil and a base material is obviously increased.

Description

technical field [0001] The invention relates to the technical field of copper foil, in particular to a micro-turbidity treatment process and equipment on the smooth surface of copper foil. Background technique [0002] Copper foil is a negative electrolytic material. It is a thin continuous metal foil deposited on the base layer of the circuit board. It is used as the conductor of the PCB. The copper foil is easily bonded to the insulating layer. The surface of copper foil can be attached to various substrates, such as metals and insulating materials, etc. Copper foil has a wide temperature range. The Chinese name of PCB (Printed Circuit Board) is printed circuit board, also known as printed circuit board. Printed circuit board is an important electronic component and a support for electronic components. Printed circuit board is the carrier of electronic components. It is made by electronic printing, so it is called a printed circuit board. [0003] With the development of...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C23F1/18C23F1/08
CPCC23F1/08C23F1/18
Inventor 林家宝
Owner 建滔(连州)铜箔有限公司
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