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Laminated type power distribution module and manufacturing method thereof

A technology for distributing modules and power, applied in the electronic field, can solve the problems of large space occupation, large insertion loss, inconvenient assembly, etc., and achieve the effects of high installation efficiency, low insertion loss and high reliability

Active Publication Date: 2017-08-11
SHENZHEN ZHENHUA FU ELECTRONICS +1
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0003] The main purpose of the present invention is to provide a laminated chip power distribution module, which aims to solve the problems of traditional power distribution modules such as large space occupation, inconvenient assembly, low isolation and large insertion loss

Method used

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  • Laminated type power distribution module and manufacturing method thereof
  • Laminated type power distribution module and manufacturing method thereof
  • Laminated type power distribution module and manufacturing method thereof

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Embodiment Construction

[0021] In order to make the object, technical solution and advantages of the present invention clearer, the present invention will be further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described here are only used to explain the present invention, not to limit the present invention.

[0022] It should be noted that when an element is referred to as being “fixed” or “disposed on” another element, it may be directly on the other element or be indirectly on the other element. When an element is referred to as being "connected to" another element, it can be directly connected to the other element or indirectly connected to the other element.

[0023] It should also be noted that the orientation terms such as left, right, up, and down in the embodiments of the present invention are only relative concepts or refer to the normal use state of the product, and should not be regarded as r...

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Abstract

The invention proposes a laminated type power distribution module which comprises an input electrode, an output electrode, an upper cover, a lower cover and a middle layer. The middle layer comprises bypass capacitor internal electrodes, power distribution coils and coupling capacitor internal electrodes. There are at least two power distribution coils in mutual parallel connection. One end of the bypass capacitor internal electrode is connected with the common ends of the power distribution coils while the other end is grounded. The common ends of the power distribution coils are connected with the input electrode. The non-common end of each power distribution coil is connected with the output electrode. Between the non-common ends of two power distribution coils in mutual parallel connection, a coupling capacitor internal electrode and an isolation resistor are connected. The isolated resistor is arranged on the surface of the upper cover and is connected with the output electrode. According to the invention, between the upper cover and the lower cover, bypass capacitor internal electrodes, power distribution coils and coupling capacitor internal electrodes are manufactured in a laminated manner, making the product highly integrated and with good welding performance. Therefore, the module is suitable for the mounting of a surface with high density; the insertion loss is small; the phase and amplitude balance is optimal; and the requirements on assembling and electrical property can be fulfilled.

Description

technical field [0001] The invention belongs to the field of electronic technology, in particular to a laminated chip power distribution module and a manufacturing method thereof. Background technique [0002] With the rapid development of electronic equipment in the direction of miniaturization, light weight and integration, the volume of electronic complete machines and systems is getting smaller and smaller, and the installation density of components is also increasing. direction of development. The microwave power distribution module is a component that divides the energy of one input signal into two or more outputs with equal or unequal energy. Traditional power distribution modules are mostly assembled devices with large volume, complicated installation methods, large insertion loss, and low isolation, which cannot meet the requirements in terms of performance and assembly methods. Therefore, it is necessary to propose a new type of power distribution module to solve ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01P5/16H01P11/00
CPCH01P5/16H01P11/00
Inventor 徐鹏飞王海黄寒寒朱建华刘季超张华良王智会
Owner SHENZHEN ZHENHUA FU ELECTRONICS
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