Graphite adhesion sheet capable of performing uniform heat conduction

Abstract

The present invention discloses a graphite adhesion sheet capable of performing uniform heat conduction. The graphite adhesion sheet comprises a graphite layer, a heat conduction adhesion layer positioned on the surface of the graphite layer, and a release material layer, wherein the release material layer is adhered on the heat conduction adhesion layer surface opposite to the graphite layer, and the graphite layer preparation method comprises: uniformly coating the upper surface and the lower surface of a polyimide film with a layer of a graphite modifier to obtain a treated polyimide film, heating the treated polyimide film to a temperature of 240-260 DEG C from a room temperature, carrying out thermal insulation, heating to a temperature of 480-520 DEG C, carrying out thermal insulation, heating to a temperature of 790-810 DEG C, heating to a temperature of 1180-1250 DEG C, cooling to obtain a pre-fired carbonized film, calendering the pre-fired carbonized film with a calendering machine, and calendering the obtained mainly-fired graphite film to obtain the graphite layer. According to the present invention, the uniformity of the heat conduction is achieved while the stability of the heat dissipating of the product is improved.

Description

technical field [0001] The invention relates to a heat-conducting uniform graphite patch, which belongs to the technical field of graphite sheets. Background technique [0002] With the rapid development of modern microelectronics technology, electronic devices (such as laptops, mobile phones, tablet computers, etc.) are increasingly becoming ultra-thin and lightweight. This structure makes the internal power density of electronic devices significantly increased, and the heat generated during operation is not easy to discharge , Easy to accumulate rapidly and form high temperature. On the other hand, high temperatures can reduce the performance, reliability and lifespan of electronic equipment. Therefore, the current electronics industry has put forward higher and higher requirements for heat dissipation materials as the core components of thermal control systems, and there is an urgent need for a highly efficient heat-conducting, lightweight material to quickly transfer he...

AI Technical Summary

Problems solved by technology

[0003] In the prior art, polyimide films are mostly used for flexible circuit boards. Although polyimide films are sintered to obtain graphite heat sinks, which can be pasted on heat sources, they are limited by the quality and quality of polyimide films. The performance is uneven, which affects the heat dissipation performance of the heat dissipation double-sided film. There are the following technical problems: uneven heat dissipation, prone to local overheating of the tape, improved product heat dissipation performance instability, poor reliability performance, and is not conducive to product quality control. affect product competitiveness