Active two-phase loop and phase change heat storage compound thermal control system

Abstract

The invention provides an active two-phase loop and phase change heat storage compound thermal control system, which belongs to the technical field of heat radiation and cooling. The system mainly comprises a heat absorber, a reservoir, a condenser, a steam line, a drive device, a liquid line and a blower fan. The heat absorber is of an integrated structure which is formed by packaging a head conducting housing, an evaporation chamber, a heat storage material and fins. The outlet of the evaporation chamber is communicated with the inlet of the condenser through the steam line, and the outlet of the condenser is connected with the reservoir and the drive device in sequence through the liquid line, and finally accesses to the inlet of the evaporation chamber, so as to form an enclosed loop. When the calorific value is small, heat can be absorbed by the heat storage material and radiated through the fins, so as to limit or delay the temperature rise; when the calorific value is larger, the drive device is started to operate the active two-phase loop. Specifically, when the heat changes dynamically or in a pulsed manner, the system maintains the good temperature control of the electronic chip or equipment, and has advantages of strong heat dissipation capacity, compact structure, safe temperature control, strong applicability, wide application range and the like.

Description

technical field [0001] The invention relates to a thermal control system combined with an active two-phase loop and phase change heat storage, belonging to the technical field of heat dissipation and cooling. Background technique [0002] The rapid development of electronic technology has brought revolutionary changes to human life. At the same time, the heat consumption of electronic devices such as laser devices, LED equipment, electronic chips and equipment has increased sharply, and the cooling and heat dissipation problems have become increasingly prominent. Excessive temperature will lead to a series of irreversible damages such as mechanical failure, corrosion failure and electrical failure of electronic devices. In addition, for this type of electronic equipment, its heat consumption will change dynamically with the application of the client, and excessive temperature changes will not only It has a huge impact on its performance and causes a reduction in the reliabil...

AI Technical Summary

Problems solved by technology

Excessive temperature will lead to a series of irreversible damages such as mechanical failure, corrosion failure and electrical failure of electronic devices. In addition, for this type of electronic equipment, its heat consumption will change dynamically with the application of the client, and excessive temperature changes will not only Have a huge impact on its performance and cause a reduction in the reliability of electronic devices

[0003] Although the traditional air-cooled radiator has a simple structure, it is increasingly difficult to meet the heat dissipation requirements of high heat flux electronic devices, and at the same time, it has poor dynamic matching performance with the actual heat consumption of electronic devices.

In the existing technology, the performance of liquid cooling is much greater than that of air cooling, but the liquid cooling of sensible heat exchange cannot achieve the isothermal performance of electronic devices, and at the same time, the damage of liquid leakage with water as the medium will be fatal to electronic devices isothermal properties of electronic devices can be achieved by heat pipe cooling using latent heat exchange, but its performance is severely affected by gravity and capillary forces, and it is difficult to start, so insufficient liquid supply under high heat flux conditions, safe temperature control, and Problems such as difficulty in starting when heat consumption is low still exist

Images