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Laser processing system and method

A laser processing method and laser processing technology, which are applied in metal processing, laser welding equipment, metal processing equipment, etc., can solve the problems of reduced laser energy utilization rate, high cost, and reduced effect of picosecond-level laser pulse adjustment.

Active Publication Date: 2017-07-11
SHANGHAI MICRO ELECTRONICS EQUIP (GRP) CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, this method still has the following deficiencies: First, the utilization rate of laser energy is inevitably reduced by adjusting the time pulse profile, and a complex laser output control system is required to adjust the output light intensity over time, which is costly ; Second, this method is only suitable for nanosecond pulsed lasers, and the adjustment effect for picosecond laser pulses is greatly reduced, so it cannot actually meet the actual needs

Method used

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Experimental program
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Embodiment 1

[0034] Such as Figure 1-3 As shown, a laser processing system of the present invention is used to process (i.e. cut) the workpiece material 2 on the workpiece table 1, including: a laser 3, which provides the laser 301 required for processing. Preferably, the laser 3 is Pulse laser, the width of its pulse is not limited, such as the laser 3 with ultrashort pulse width, which is beneficial to control the thermal influence in the cutting process; the optical system 4 is located above the workpiece table 1, and adjusts the laser 301, and project the adjusted laser 301 spot onto the workpiece table 1; the sensor 5 is arranged above the workpiece table 1, and collects the parameter information of the workpiece material 2; the processor 6 communicates with the workpiece table 1. The sensor 5 is connected to receive and process the parameter information collected by the sensor 5 to obtain the spot size of the laser 301 required by the workpiece material 2; the controller 7 is connec...

Embodiment 2

[0045] The difference from Embodiment 1 is that in Embodiment 2, the optical system 4 includes a turntable mechanism 403, and the turntable mechanism 403 is provided with a number of through holes, and the number of the through holes is 3-5. In the example, there are 4 through holes, and diffractive optical elements are arranged in the through holes, and the shapes of the diffractive optical elements in the 4 through holes are different, and the spot shape obtained by the laser 301 through different diffractive optical elements and different sizes, such as Figure 4a As shown, 404a-404d are different diffractive optical elements installed on the turntable mechanism 403. When the laser light 301 is incident on the diffractive optical element, different diffractive spots 405a-405d will be formed, as shown in Figure 4b As shown, 405a is an elliptical spot formed by 404a with a major axis l1 and a minor axis m2. Assuming that the laser pulse energy is u, the corresponding laser p...

Embodiment 3

[0047] Different from Embodiment 1, in this embodiment, the sensor 5 is a laser displacement sensor, which measures the thickness of the workpiece material 2 and the remaining thickness of the material after cutting, so as to obtain the cutting depth of the workpiece material 2, and the processor 6 Adjust the laser pulse energy density according to the change of cutting depth to adjust the cutting depth, among which reducing the spot area can increase the laser energy pulse density to obtain a greater depth of cut, increasing the spot area can reduce the laser energy pulse density to reduce the cutting depth , if the target cutting depth of the workpiece material 2 is L, and the processor 6 calculates the current cutting depth as L1, then the deviation ΔL=L1–L, at this time, the controller 7 runs the PID control algorithm to obtain the currently required spot The area is controlled by the controller 7 so that the actual depth of cut is consistent with the target depth of cut, a...

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Abstract

The invention discloses a laser processing system and method. The laser processing system comprises a laser machine, an optical system, a sensor, a processor and a controller, wherein the laser machine is used for providing laser needed for processing, the optical system is arranged above a workpiece table and is used for adjusting the size of a laser spot, and projecting the adjusted laser spot onto the workpiece table, the sensor is arranged above the workpiece table and is used for collecting parameter information of workpiece material, the processor is connected with the sensor and is used for receiving and processing the parameter information acquired by the sensor to obtain the size of the laser spot needed by the workpiece material, and the controller is connected with the processor and is used for receiving the information of the processor to control the optical system. According to the laser processing system, the parameter information of the workpiece material is collected in real time through the sensor, the required size of the laser spot is calculated through the processor, the laser pulse energy density is adjusted in real time by adopting the controller to control the optical system to change the size of the laser spot, so that the real-time performance is good, and the cutting efficiency is high; and in the cutting process, the laser machine outputs lasers at the rated laser power all the time, and the utilization rate of laser energy is improved.

Description

technical field [0001] The invention relates to the field of semiconductor processing, in particular to a laser processing system and method. Background technique [0002] In the field of semiconductor processing, semiconductor devices are usually manufactured in batches on a wafer, and after processing, the devices on the wafer need to be separated into individual chips, so the wafer needs to be cut. [0003] Mechanical cutting is usually used for wafer workpieces, mainly including three cutting methods: grinding wheel cutter, laser cutting and ion etching. Among them, the cutting path of the grinding wheel cutter is relatively wide, which is easy to cause edge chipping and cracks when cutting and thinning wafer workpieces. In addition, since more and more semiconductor devices use low-k dielectric materials, the ductility and low adhesion of the materials make cutting very difficult, easily causing cracks and splits in the cutting area. layer, and even wrap the blade and ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B23K26/38B23K26/064B23K26/402B23K26/70
CPCB23K26/0648B23K26/38B23K2101/40
Inventor 徐文宋春峰王帆
Owner SHANGHAI MICRO ELECTRONICS EQUIP (GRP) CO LTD
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