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Flat plate loop heat pipe-based closed chassis cooling system

A flat-panel loop and heat dissipation system technology, applied in the direction of instruments, electrical digital data processing, digital data processing components, etc., can solve problems such as computer failure, development level impact, and increase user additional costs, to achieve compressed size and volume, Effect of high heat transfer capacity and compact design

Inactive Publication Date: 2017-06-30
BEIJING INST OF SPACECRAFT SYST ENG
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] With the increasing development of computer and Internet technology, desktop computers have become an indispensable part of people's lives. The popularity of computers makes the environment in which computers are located complex and diverse. Computers are electronic products, and dust and humid environments will cause computer failures. Cleaning and maintenance, fault repair and complete machine replacement caused by faults will increase the user's additional costs
[0003] The CPU and GPU are the core power consumption components of the computer. In order to ensure their working performance, they need to be effectively dissipated to maintain their working temperature. At present, the cooling of the computer chassis is mainly based on ventilation and heat dissipation. Ventilation and heat dissipation require the chassis to be open. , in order to maintain the cooling boundary of the system, this heat dissipation method cannot realize the enclosure of the chassis, and cannot prevent the entry of dust and moisture, so the open chassis design is the core factor that causes computer failures, and the closed chassis design is an effective means to solve the above problems, but the traditional Influenced by the development level of thermal technology, it has not been popularized and applied

Method used

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  • Flat plate loop heat pipe-based closed chassis cooling system
  • Flat plate loop heat pipe-based closed chassis cooling system
  • Flat plate loop heat pipe-based closed chassis cooling system

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Embodiment Construction

[0019] The present invention will be described in detail below with reference to the accompanying drawings and examples.

[0020] This embodiment provides a closed computer heat dissipation system based on a flat-plate loop heat pipe, which changes the heat dissipation method of ventilation and heat dissipation of the traditional computer case, and adopts a flat-plate loop heat pipe heat transfer technology for high-power devices on the basis of fully sealing the computer case. To dissipate heat.

[0021] like figure 1 As shown, the fully enclosed computer heat dissipation system includes: a closed chassis 10, heat dissipation fins 20, and flat-plate loop heat pipes 30; wherein, multiple sets of flat-plate loop heat pipes 30 can be set according to the needs of heat dissipation devices, figure 1 Two sets of flat loop heat pipes 30 are arranged in the enclosed cabinet 10 shown.

[0022] The closed chassis 10 is equipped with a flat-plate loop heat pipe 30 inside and a cooling...

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Abstract

The invention discloses a flat plate loop heat pipe-based closed chassis cooling system capable of achieving closed design of a cooling chassis on the basis of solving the cooling problem of a high-power component. The closed chassis cooling system comprises a closed chassis, radiating fins arranged outside a closed chassis, and more than one set of flat plate loop heat pipes arranged in the closed chassis, wherein an evaporator of each flat plate loop heat pipe is clung to a to-be-cooled device in the closed chassis; the closed chassis comprises a movable side plate, a chassis frame and a cooling side plate; one end of the chassis frame is closed through the movable side plate and the other end is closed through the cooling side plate; and the radiating fins and condensers of the flat plate loop heat pipes are integrated on the cooling side plate. According to the cooling system, heat is transmitted to the outside of the chassis for discharging through the flat plate loop heat pipes, the closed design of the chassis is achieved, dustproof and dampproof effects of the chassis are achieved, the service life of corresponding equipment can be prolonged, and the reliability and the adaptability on complicated and harsh operating environments can be improved.

Description

technical field [0001] The invention relates to a heat dissipation system, in particular to a heat dissipation system based on the flat plate loop heat pipe heat transfer technology, which belongs to the field of heat dissipation technology. Background technique [0002] With the increasing development of computer and Internet technology, desktop computers have become an indispensable part of people's lives. The popularity of computers makes the environment in which computers are located complex and diverse. Computers are electronic products, and dust and humid environments will cause computer failures. Cleaning and maintenance, failure repair and replacement of the whole machine caused by failure will increase the additional cost of the user. [0003] The CPU and GPU are the core power consumption components of the computer. In order to ensure their working performance, they need to be effectively dissipated to maintain their working temperature. At present, the cooling of ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G06F1/20G06F1/18
CPCG06F1/181G06F1/20Y02D10/00
Inventor 刘东晓张红星满广龙李国广
Owner BEIJING INST OF SPACECRAFT SYST ENG
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