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Large-channel semiconductor laser liquid refrigeration sheet and laser thereof

A refrigeration chip and semiconductor technology, applied in semiconductor lasers, lasers, laser parts and other directions, can solve problems such as blockage of microchannels, and achieve the effects of improving reliability and life, improving heat dissipation efficiency, and shortening heat conduction paths.

Pending Publication Date: 2017-06-23
FOCUSLIGHT TECH
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  • Summary
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  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] In order to overcome the deficiencies in the prior art, the present invention proposes a large-channel semiconductor laser liquid cooling chip and a semiconductor laser stack using the liquid cooling chip, which avoids the problem of micro-channel blockage, and compared with the macro-channel liquid cooling chip The heat dissipation effect is improved, and the specific technical scheme is as follows:

Method used

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  • Large-channel semiconductor laser liquid refrigeration sheet and laser thereof
  • Large-channel semiconductor laser liquid refrigeration sheet and laser thereof
  • Large-channel semiconductor laser liquid refrigeration sheet and laser thereof

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Embodiment Construction

[0022] Such as figure 1 It is the liquid cooling sheet of the large-channel semiconductor laser of the present invention, including a sheet-shaped cooling sheet main body 11; the liquid inlet hole 1 and the liquid outlet hole 2 are arranged on the cooling sheet main body 11, and the liquid inlet hole 1 and the liquid outlet hole The holes 2 all pass through the upper surface and the lower surface of the main body 11 of the refrigerating sheet; a chip mounting area 5 is arranged on the end of the main body 11 of the refrigerating sheet near the liquid inlet hole 1 for installing a laser chip; There is a water inlet 3, a water outlet 4 is provided on the inner wall of the liquid outlet hole 2, and a tubular liquid cooling channel 6 is provided in the main body 11 of the cooling plate for connecting the water inlet 3 and the water outlet 4, and the liquid cooling channel 6 Starting from the water inlet 3, the path passes through the area between the chip mounting area 5 and the l...

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Abstract

The invention provides a large-channel semiconductor laser liquid refrigeration sheet and a semiconductor laser stack array employing the liquid refrigeration sheet. The large-channel semiconductor laser liquid refrigeration sheet comprises a refrigeration sheet main body provided with a liquid-inlet hole and a liquid-outlet hole, and a tubular liquid refrigeration channel used for communicating the liquid-inlet hole and the liquid-outlet hole is arranged in the refrigeration sheet main body. According to the large-channel semiconductor laser liquid refrigeration sheet, the liquid refrigeration channel is not easily blocked, the reliability of the device is improved, the lifetime of the device is prolonged, and the heat radiation effect of the large-channel refrigeration sheet is equivalent to that of a micro-channel refrigeration sheet in the same flow condition; and compared with the conventional macro-channel liquid refrigeration sheet, according to the large-channel liquid refrigeration sheet, the refrigeration area is increased, the thermal conduction path is shortened, and the heat radiation efficiency is improved.

Description

technical field [0001] The invention belongs to the technical field of semiconductor lasers, and in particular relates to a large-channel semiconductor laser liquid cooling chip and a semiconductor laser stack using the liquid cooling chip. Background technique [0002] Semiconductor lasers have the advantages of small size, light weight, high reliability, long service life, and low cost. They have been widely used in various fields of the national economy, such as laser pumping, medical treatment, and industrial processing. [0003] In the prior art, the packaging forms of power electronic devices include conduction cooling type, micro-channel liquid cooling type and macro-channel liquid cooling type (200910023753.3). For high-power semiconductor lasers, conduction cooling is used, and the heat dissipation efficiency is low, which will lead to a decrease in device life and reliability, and generally can only reach an output power of tens of watts; if micro-channel liquid co...

Claims

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Application Information

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IPC IPC(8): H01S5/024
CPCH01S5/02423
Inventor 梁雪杰于冬杉刘兴胜
Owner FOCUSLIGHT TECH
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