Efficient heat dissipation device based on array sprays

Abstract

The invention discloses an efficient heat dissipation device based on array sprays. The efficient heat dissipation device comprises a heated workpiece, a cavity end cover, a plurality of nozzles and a working medium pressure distributor. The cavity end cover and the heated workpiece form a closed atomizing cavity used for mounting of the nozzles. The multiple nozzles are arranged on the cavity end cover in an array mode and used for spraying toward the heated surface of the heated workpiece. The working medium pressure distributor is used for distributing heat exchange working mediums to the multiple nozzles to enable the multiple nozzles to be in a pressure equalizing state. A mounting posture of the cavity end cover meets the mode of spraying upward adopted by the array nozzles, and a working medium discharging hole is formed in the cavity end cover. The efficient heat dissipation device can be used independently and also can be combined with other structures of a high-speed rotating structure and the like, and an efficient heat dissipation means is provided for heat dissipation problems in the fields of high-power microelectronics machinery and chips, aerospace heat controlling, high-power solid laser cooling, high-energy particle accelerator target systems and the like.

Description

technical field [0001] The invention relates to a high-efficiency spray cooling heat dissipation device aimed at high power and ultra-high heat flux. Background technique [0002] High heat flux heat dissipation technology is mainly aimed at high-power microelectronic machinery and chips, aerospace thermal control, high-power solid-state laser cooling, high-energy particle accelerator target system and other fields with high heat dissipation heat flux density and strict space requirements, and traditional cooling methods can no longer meet the requirements. . [0003] Spray cooling is an effective heat dissipation method for high heat flux density. Due to its advantages of strong heat dissipation capacity, small demand for working fluid, low degree of superheat and small contact thermal resistance, it is widely used in electronic devices, laser arrays, ion beam arrays, etc. The field of forced cooling of heat flux has broad application prospects. [0004] In the current re...

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Problems solved by technology

[0005] At present, spray cooling technology is mostly used in empty or open spaces, but in a compact space, the arrangement of array spray nozzles on a large-area heating surface faces two problems: the pressure of each nozzle is not balanced, resulting in a large difference in spray flow rate, thus The heat dissipation effect of the heating surface is uneven; after the mist vaporizes on the heating surface, it is easy to cause gas or liquid to accumulate in the closed space, resulting in the inability to effectively form a spray and spray cooling failure

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