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MEMS microphone

A microphone and shell technology, applied in the field of microphones, can solve problems such as reducing the strength of the diaphragm itself, and achieve the effect of avoiding airflow impact damage and ensuring its own strength.

Inactive Publication Date: 2017-06-13
AAC ACOUSTIC TECH (SHENZHEN) CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The diaphragm of the MEMS chip is often damaged by the airflow impact caused by blowing, dropping or temperature changes. The usual solution is to open a groove or hole through the diaphragm on the diaphragm to balance the air pressure on both sides of the diaphragm. However, in Opening grooves or holes on the diaphragm will reduce the strength of the diaphragm itself

Method used

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Embodiment Construction

[0026] The present invention will be described in detail below in conjunction with the accompanying drawings and embodiments.

[0027] Such as Figure 1 to Figure 4 As shown, the MEMS microphone 100 provided by the present invention includes a housing 1 having a housing cavity 10, and an acoustic hole 2 provided on the housing 1. In this embodiment, the housing 1 includes a circuit board 11 and a cover The cover 12 connected to the circuit board 11 , the circuit board 11 and the cover 12 enclose the receiving cavity 10 . The cover 12 is made of metal material.

[0028] A casing 3 with a cavity 30 , a MEMS chip 4 with a back cavity 40 and an ASIC chip 5 are arranged in the housing cavity 10 , and the MEMS chip 4 includes a diaphragm 41 . In this embodiment, the housing 3 is installed on the circuit board 11 , of course, the housing 3 can also be installed on the cover 12 . The housing 3 is preferably made of silicon material.

[0029] The MEMS chip 4 is installed on the hou...

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Abstract

The invention discloses an MEMS microphone comprising a housing provided with an accommodation cavity and a sound hole formed in the housing, wherein a shell with a hollow cavity, an MEMS chip with a back cavity and an ASIC chip are arranged in the accommodation cavity, the shell is installed in the housing, the MEMS chip is installed in the shell, the shell is provided with a through hole for communicating the hollow cavity with the back cavity, the shell is further provided with an air leakage hole for communicating the hollow cavity with the accommodation cavity, the MEMS microphone further comprises a membrane flap arranged in the shell for closing the air leakage hole, and the membrane flap deforms under the action of airflow to open the air leakage hole. The MEMS microphone disclosed by the invention can avoid the vibrating diaphragm of the MEMS chip from being damaged by airflow impact.

Description

[0001] 【Technical field】 [0002] The invention relates to the field of microphones, in particular to a MEMS microphone. [0003] 【Background technique】 [0004] The MEMS microphone in the related art includes a housing with a housing cavity, an acoustic hole opened on the housing, and a MEMS chip and an ASIC chip accommodated in the housing cavity. [0005] The diaphragm of the MEMS chip is often damaged by the airflow impact caused by blowing, dropping or temperature changes. The usual solution is to open a groove or hole through the diaphragm on the diaphragm to balance the air pressure on both sides of the diaphragm. However, in Opening grooves or holes on the diaphragm will reduce the strength of the diaphragm itself. [0006] Therefore, it is necessary to provide a new MEMS microphone to solve the above problems. [0007] 【Content of invention】 [0008] The purpose of the present invention is to provide a MEMS microphone which can prevent the diaphragm of the MEMS chip...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H04R19/04
CPCH04R19/04H04R2400/11B81B7/0029B81B7/0061B81B2201/0257B81B2207/012H04R1/04H04R2201/003B81B2203/0127B81B2203/019B81B2203/0315B81B2203/0353H04R7/04H04R7/18H04R19/005
Inventor 张金宇
Owner AAC ACOUSTIC TECH (SHENZHEN) CO LTD
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