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A printed circuit board type molten salt gas heat exchanger

A technology for printed circuit boards and gas heat exchangers, applied in the direction of indirect heat exchangers, heat exchanger types, heat exchanger fixation, etc., can solve the problem of shortening the service life of heat exchangers, large thermal expansion effects of heat exchanger channels, etc. problems, achieve the effect of reducing volume and weight, increasing heat transfer area density, and reducing pressure loss

Active Publication Date: 2019-12-10
SHANGHAI ADVANCED RES INST CHINESE ACADEMY OF SCI
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Taking binary nitrate as an example, its melting point is 207°C, and its complete melting temperature is 238°C. When the molten salt is lower than 238°C, solid crystals will appear, and the viscosity will increase sharply as the temperature drops below 300°C. Therefore, the lower temperature The molten salt needs to be heated up to avoid clogging, but the molten salt at a higher temperature will cause a large thermal expansion effect on the flow channel of the heat exchanger, shortening the service life of the heat exchanger

Method used

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  • A printed circuit board type molten salt gas heat exchanger
  • A printed circuit board type molten salt gas heat exchanger

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Embodiment Construction

[0040] The implementation of the present invention will be illustrated by specific specific examples below, and those skilled in the art can easily understand other advantages and effects of the present invention from the contents disclosed in this specification.

[0041] see Figure 1 to Figure 2 It should be noted that the structures, proportions, sizes, etc. shown in the drawings attached to this specification are only used to match the content disclosed in the specification, for those who are familiar with this technology to understand and read, and are not used to limit the implementation of the present invention. Limiting conditions, so there is no technical substantive meaning, any modification of structure, change of proportional relationship or adjustment of size, without affecting the effect and purpose of the present invention, should still fall within the scope of the present invention. within the scope covered by the disclosed technical content. At the same time,...

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Abstract

The invention provides a printed circuit board type molten salt gas heat exchanger. The heat exchanger comprises a heat exchange plate core, wherein the heat exchange plate core comprises at least one periodic structure, and the at least one periodic structure comprises a first gas heat exchange plate, a molten salt heat exchange plate and a second gas heat exchange plate which are sequentially stacked; the molten salt heat exchange plate is provided with multiple molten salt flow channels, and each molten salt flow channel extends from a longitudinal first end of the molten salt heat exchange plate to a longitudinal second end of the molten salt heat exchange plate; multiple gas flow channels are formed in each of the first gas heat exchange plate and the second gas heat exchange plate, and each gas flow channel extends from a transverse first end of the corresponding gas heat exchange plate to a transverse second end of the corresponding gas heat exchange plate. Heat exchange is realized in a cross flow manner, space is allocated reasonably, and sensible heat of hot salt is used to a great extent; the periodic curved structures of the flow channels can improve the turbulence of fluids, break heat exchange boundary layers near walls and improve heat exchange efficiency.

Description

technical field [0001] The invention relates to the field of heat exchange devices, in particular to a printed circuit board type molten salt gas heat exchanger. Background technique [0002] Heat exchangers are widely used in petrochemical, aerospace, ocean engineering, shipbuilding, nuclear power and other industrial fields, which can realize heat exchange between different working fluids, but the existing types of heat exchangers generally have low heat transfer area density. , large volume and weight, poor high temperature and high pressure resistance, and low heat transfer efficiency, especially in the field of nuclear power. With the popularization and application of fourth-generation nuclear reactors, heat exchangers built by traditional welding methods cannot meet the requirements of high temperature and high pressure media in nuclear reactors. Requirements. New high-efficiency heat exchange equipment with high temperature and high pressure resistance is required. ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): F28D9/00F28F3/08F28F19/00F28F21/08
CPCF28D9/0037F28F3/086F28F19/00F28F21/081F28F2275/061
Inventor 杜培君孔巧玲黄伟光
Owner SHANGHAI ADVANCED RES INST CHINESE ACADEMY OF SCI
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