Semiconductor embedded hybrid packaging structure and manufacturing method thereof

Abstract

The invention discloses a semiconductor embedded hybrid package structure and a manufacturing method thereof. The package structure comprises: a circuit board having a first surface and a second surface oppositely arranged; Openings or cavities of semiconductor chips (Bare Die) and semiconductor chip packages (Semiconductor Package); semiconductor chips arranged in openings or cavities; semiconductor chip packages arranged in openings or cavities; packaging materials, at least To cover the first surface of the circuit board and fill the space in the opening or cavity not occupied by the semiconductor chip and the semiconductor chip package; the redistribution layer is at least used to electrically connect the semiconductor chip, the semiconductor chip package and the circuit board. The semiconductor embedded hybrid packaging structure and the manufacturing method thereof in the present invention adopt the circuit board embedded technology scheme, which can simplify the integration process of semiconductor chips and semiconductor chip packages, improve the integration quality and performance, and effectively reduce the integration area.

Description

technical field [0001] The invention relates to a circuit carrier packaging structure, in particular to a semiconductor embedded hybrid packaging structure and a manufacturing method thereof. Background technique [0002] In the prior art, the packaging of the semiconductor chip and the assembly of the semiconductor chip package are completed by the electronic packaging factory and the electronic assembly factory respectively. Firstly, the packaging of the semiconductor chip is completed, and then the semiconductor chip package is assembled on the circuit board. The assembly of the semiconductor chip package on the circuit board is usually completed by a surface mount process. [0003] Surface mount technology (Surface Mount Technology, SMT) is a method of mounting non-pin or short-lead surface mount components (SMC / SMD for short, Chinese chip components) on printed circuit boards (Printed CircuitBoard, PCB). On the surface or the surface of other substrates, the circuit as...

AI Technical Summary

Problems solved by technology

In addition, on the surface mount, the semiconductor chip package and the circuit board are usually electrically interconnected through a solder connection. At present, the solder connection of the surface mount requires a large pad and a pad pitch of the semiconductor package device, such as a solder joint. Pad / pad spacing = 280 microns / 400 microns, the precision needs to be improved, and the solder connection requires more complicated solder reflow process control;

[0007] In addition, the semiconductor chip package is assembled on the circuit board by surface mount method. Due to the increase in the area of ​​the semiconductor chip package, it will occupy a larger surface area of ​​the circuit board, which hinders the miniaturization of semiconductor package device assembly.

Images