Uv-thickening thermally conductive silicone grease composition

Abstract

A UV-thickening thermally conductive silicone grease composition: which has (A) an organopolysiloxane, the viscosity at 25 DEG C of which is 50-100,000 mPa*s and which contains at least one alkenyl group in a single molecule, (B) an organohydrogen polysiloxane, a single molecule of which contains a hydrogen atom directly bonded to at least two silicon atoms, (C) a photoactive platinum complex curing catalyst, and (D) a thermally conductive filler with a thermal conductivity of at least 10 W / m*DEG C as essential components; and the viscosity at 25 DEG C of which is 30-800 Pa*s when measured at a 10 rpm rotation rate using a Malcom viscometer. For this UV-thickening thermally conductive silicone grease composition, shape-retaining properties at low viscosity are high, deep curing properties can be adjusted using the UV irradiation dose, and the composition after being thickened by irradiating UV rays does not become hard but sets so as to be malleable.

Description

technical field [0001] In particular, the present invention relates to a one-component ultraviolet ray that is interposed between a heat-generating member (heat-generating body) such as an electric or electronic component, and a heat-radiating member (cooling body), and is suitable for transferring heat generated by the heat-generating member to the heat-radiating member. Thickened thermally conductive silicone grease composition. Background technique [0002] In the main systems such as engine control, power system, and air conditioning control in the conveyor, the content of control is refined, and the systems required for control are also increasing. Along with this, the number of mounted electronic control units (ECUs) has also increased year by year, and the number of electronic components mounted inside tends to increase. In order to efficiently transfer the heat generated by various electronic components and parts with different heights to the aluminum alloy die-cast...

AI Technical Summary

Problems solved by technology

However, this addition one-component thermally conductive silicone composition also has problems

This has the following problems: When the viscosity of the addition single-liquid thermally conductive silicone composition is further reduced, fluidity occurs, and it is spread on the electronic component immediately after being discharged, and it cannot be used when the gap between the electronic component and the cooling substrate is wide. Make sure the heat dissipation path

[0010] As for the above-mentioned other curing means, an organopolysiloxane gel composition using a platinum complex curing catalyst that becomes photoactive by ultraviolet rays has been proposed. Although there is a description of adding an inorganic filler as an optional component, there is no There is no description about the addition amount, and there is no description about thermal conductivity, and there are also difficulties in storage stability in a single-liquid form (Japanese Patent No. 3865638: Patent Document 10)

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