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Boron nitride/epoxy resin composite material and preparation method thereof

A technology of composite materials and epoxy resin, applied in the field of composite materials, can solve the problems of unsatisfactory heat dissipation of devices and low thermal conductivity, and achieve the effect of simple and mild preparation method and excellent thermal conductivity

Active Publication Date: 2017-05-24
SHENZHEN INST OF ADVANCED TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the intrinsic thermal conductivity of most polymer materials is very low. For example, the thermal conductivity of pure epoxy resin, which is widely used, is only 0.1-0.5W m -1 K -1 , far from meeting the heat dissipation requirements of the device

Method used

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  • Boron nitride/epoxy resin composite material and preparation method thereof
  • Boron nitride/epoxy resin composite material and preparation method thereof
  • Boron nitride/epoxy resin composite material and preparation method thereof

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preparation example Construction

[0045] The specific embodiment part of the present invention also provides a kind of preparation method of above-mentioned boron nitride / epoxy resin composite material, and described method comprises the following steps:

[0046] (1) Boron nitride is added to the aqueous solution of sodium carboxymethyl cellulose, and mixed by ball milling to obtain boron nitride-sodium carboxymethyl cellulose aqueous solution;

[0047] (2) The boron nitride-carboxymethylcellulose sodium aqueous solution obtained in step (1) is rapidly cooled, freeze-dried after complete freezing, and obtains a three-dimensional boron nitride network airgel;

[0048] (3) curing agent and catalyst are added in the epoxy resin, mixed to obtain the epoxy resin mixture;

[0049] (4) injecting the epoxy resin mixture obtained in step (3) into the three-dimensional boron nitride network aerogel obtained in step (2) under reduced pressure, and curing by heating to obtain a boron nitride / epoxy resin composite material...

Embodiment 1

[0052] A preparation method of boron nitride / epoxy resin composite material, said method comprising the following steps:

[0053] (1) Add 2 g of boron nitride to 10 mL of an aqueous solution of sodium carboxymethyl cellulose (the concentration of sodium carboxymethyl cellulose is 10 mg / mL), and mix by ball milling at 200 rpm for 1 h to obtain boron nitride-carboxymethyl Sodium cellulose aqueous solution;

[0054] (2) The boron nitride-carboxymethylcellulose sodium aqueous solution obtained in step (2) is rapidly cooled, and freeze-dried for 48 hours after complete freezing to obtain a three-dimensional boron nitride network airgel;

[0055] (3) Add 0.5g of 4,4'-dihydroxybiphenyl and 0.05g of imidazole to 2g of 4,4'-bis(2,3-epoxypropoxy)biphenolate, mix to obtain epoxy resin mixture ;

[0056] (4) Reduce the pressure to -15Pa, inject the epoxy resin mixture obtained in step (3) into the three-dimensional boron nitride network airgel obtained in step (2) for 2 hours, and then ...

Embodiment 2

[0059] A preparation method of boron nitride / epoxy resin composite material, said method comprising the following steps:

[0060] (1) Add 4g of boron nitride to 10mL of sodium carboxymethyl cellulose in aqueous solution (concentration of sodium carboxymethyl cellulose is 10mg / mL), and mix by ball milling at 200rpm for 12h to obtain boron nitride-carboxymethyl Sodium cellulose aqueous solution;

[0061] (2) The boron nitride-carboxymethylcellulose sodium aqueous solution obtained in step (2) is rapidly cooled, and freeze-dried for 48 hours after complete freezing to obtain a three-dimensional boron nitride network airgel;

[0062] (3) Add 5g of 4,4'-diaminobiphenyl and 0.5g of triphenylphosphine to 8g of 4,4'-biphenol-bis[4-(2-glycidoxy)benzoate] In, mix and obtain epoxy resin mixture;

[0063] (4) Reduce the pressure to -15Pa, inject the epoxy resin mixture obtained in step (3) into the three-dimensional boron nitride network airgel obtained in step (2) for 2 hours, and then...

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Abstract

The invention relates to a boron nitride / epoxy resin composite material. The boron nitride has a three-dimensional network structure, and the composite material comprises, by mass, 5-50% of boron nitride, 0.5-2% of sodium carboxymethylcellulose, 35-80% of epoxy resin, 10-30% of a curing agent and 0.1-10% of a catalyst. Boron nitride nanosheets in the composite material form a highly-ordered three-dimensional heat conduction network in a matrix, so the interface heat resistance is effectively reduced, and the heat conduction performance of the composite material is improved.

Description

technical field [0001] The invention belongs to the field of composite materials, and relates to a boron nitride / epoxy resin composite material and a preparation method thereof. Background technique [0002] With the continuous development of human science and technology, electronic products such as computers and mobile phones have entered thousands of households. These technical innovations are based on the increasingly integrated, miniaturized and high-speed electronic devices on the printed circuit board. Electronic devices with such a high level of integration will undoubtedly dissipate a lot of heat during operation, and the continuous accumulation of heat and the inability to dissipate it in time will bring many serious consequences. Therefore, the timely discharge and dissipation of heat has increasingly become a key technical issue that restricts the development of the semiconductor electronic packaging industry. Therefore, the design of next-generation electronic ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08L63/00C08L1/28C08K3/38C09K5/14
CPCC08L63/00C08L2201/08C09K5/14C08L1/286C08K2003/385
Inventor 孙蓉胡建滔曾小亮黄云么依民许建斌
Owner SHENZHEN INST OF ADVANCED TECH
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