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LED lamp assembly

A technology of LED lamps and LED devices, which is applied in the parts of lighting devices, semiconductor devices of light-emitting elements, lighting devices, etc., can solve the problems of heavy weight of lighting products, loss of heat dissipation performance, high density of aluminum alloys, etc., and achieve the goal of eliminating safety. Hidden danger, weight reduction, good heat dissipation effect

Inactive Publication Date: 2017-05-17
TIANJIN POLYTECHNIC UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the density of aluminum alloy is also relatively high, and the weight of the produced lamps is still relatively heavy. For large LED lamps with high power and high installation positions such as street lamps, high pole lamps, and industrial and mining lamps, in order to prevent high-altitude In order to avoid the safety hazard of falling objects, it is often necessary to set a safety upper limit for the weight of the radiator
Therefore, while implementing the weight reduction design, the aluminum alloy radiator will lose part of its heat dissipation performance

Method used

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Embodiment Construction

[0028] Below, the substantive features and advantages of the present invention will be further described in conjunction with examples, but the present invention is not limited to the listed examples.

[0029] see Figure 1-3 As shown, an LED lamp assembly includes a finned radiator module made of magnesium alloy, a light source module and a power drive module; the finned radiator module includes a rectangular radiator substrate 3 and equidistantly arranged The ribs on one surface of the heat sink substrate; the power drive module includes LED power supply (not shown in the figure) and a plurality of rectangular aluminum bases installed on the other surface of the heat sink substrate at even intervals Printed circuit board (MCPCB) 2, the installation interface between the aluminum-based printed circuit board and the heat sink substrate is filled with thermal conductive silicone grease; the light source module includes a plurality of LED devices 1 with equal working power; Two ...

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Abstract

The invention relates to an LED lamp assembly which comprises a radiator substrate and fins mounted on the radiator substrate, wherein the fins comprise three types namely short-high type fins, short-low type fins and long-low type fins; the short-low type fins are positioned on two edges of the radiator substrate in the width direction; the short-high type fins are dispersed in the middle of the radiator substrate in the width direction; and the long-low type fins are distributed between the short-low type fins and the short-high type fins. The LED lamp assembly is light in weight, has better radiating characteristic, can rapidly transfer heat generated when an LED works to the surfaces of the radiator fins to ensure that an LED chip has lower temperature, improve the luminescence efficiency and prolong the service life; and the structural arrangement of the fins facilitates improvement of the comprehensive effect of natural heat loss through convection.

Description

technical field [0001] The invention belongs to the technical field of LED lamps, and in particular relates to an LED lamp assembly. Background technique [0002] In recent years, LED (Light Emitting Diode) has gradually become the most promising green lighting source in the 21st century due to its advantages such as high energy efficiency, long life, good color rendering, quick response, no flicker, and high brightness. And it has achieved more and more extensive and in-depth commercial applications in multiple lighting fields. [0003] In order to meet the market demand for higher brightness lighting products, the input power of LED lamps continues to increase. However, most of the power consumed by high-power LEDs will be converted into heat. Without effective heat dissipation measures, the heat will accumulate on the chip, which will directly lead to a rapid rise in junction temperature. Since LEDs are heat-sensitive devices, working at excessively high temperatures fo...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): F21K9/20F21V29/89F21V29/76F21V23/00F21V29/50F21V19/00F21Y115/10
CPCF21S2/00F21V19/0025F21V23/003
Inventor 张建新蒋怡娜孙伟高志刚杨庆新牛萍娟武冰洁马楷李海林谷承儒
Owner TIANJIN POLYTECHNIC UNIV
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