Embedded packaging structure based on semiconductor chip packaging body and packaging method thereof

Abstract

The invention discloses an embedded packaging structure based on a semiconductor chip packaging body and a packaging method thereof. The embedded packaging structure comprises a circuit board having a first surface and a second surface which are oppositely arranged, at least one opening or chamber which is arranged in the circuit board and is used for accommodating the semiconductor chip packaging body, the semiconductor chip packaging body arranged in the opening or the chamber, a packaging material at least used for covering the first surface of the circuit board and filling space of the opening or the chamber not being occupied by the semiconductor chip packaging body, and a rewiring layer at least used for electrically connecting the semiconductor chip packaging body and the circuit board. The embedded packaging structure is advantaged in that the semiconductor chip packaging body is assembled through employing the circuit board embedding technology, an assembling technology process of the semiconductor chip packaging body can be simplified, assembling quality and performance can be improved, and an assembling area can be effectively reduced.

Description

technical field [0001] The invention relates to a high-end circuit carrier board packaging structure, in particular to an embedded packaging structure based on a semiconductor chip package and a packaging method thereof. Background technique [0002] Surface mount technology (Surface Mount Technology, SMT) is a method of mounting non-pin or short-lead surface mount components (SMC / SMD for short, Chinese chip components) on printed circuit boards (Printed Circuit Board, PCB) The circuit assembly technology that solders and assembles the surface of the substrate or the surface of other substrates by reflow soldering or dip soldering. Surface mount technology has high assembly density, small size and light weight of electronic products. The volume and weight of SMD components are only about 1 / 10 of traditional plug-in components. Generally, after SMT is used, the volume of electronic products is reduced by 40% to 60%. The weight is reduced by 60% to 80%. The assembly of semic...

AI Technical Summary

Problems solved by technology

[0004] At present, the solder connection of surface mount requires a large pitch between the pad and the pad of the semiconductor package device, such as the pad / pad pitch = 280 microns / 400 microns, the soldering is not precise enough, and the solder connection needs to be more complicated. Solder reflow process control;

[0005] In addition, the semiconductor packaging device is assembled on the circuit board by surface mount method. Due to the relatively large area of ​​the semiconductor packaging device, it will occupy a large surface area of ​​the circuit board, which hinders the miniaturization of semiconductor packaging device assembly.

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