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Resin composition and application thereof

A technology of resin composition and epoxy resin, applied in lamination, layered products, metal layered products, etc., can solve the problems of low crosslink density and high brittleness of cured products

Active Publication Date: 2017-05-10
SHENGYI TECH SUZHOU
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

Although benzoxazine resin has a high glass transition temperature (Tg) and good mechanica

Method used

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  • Resin composition and application thereof
  • Resin composition and application thereof
  • Resin composition and application thereof

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Abstract

The invention relates to a resin composition and application thereof, especially in high-frequency encapsulated high-density-interconnected high-performance prepreg, metal-foil-coated laminated plates and interlayer insulating films. The resin composition comprises, by weight, 100 parts of epoxy resin, 1-100 parts of active ester and 0.001-5 parts of curing accelerator, a structural general formula of the active ester is shown as (I) or (II) or a combination of (I) and (II). The invention further relates to the high-performance prepreg, the metal-foil-coated laminated plates and the interlayer insulating films made by utilizing the resin composition. Cured products made of the resin composition have low dielectric constant and dielectric loss tangent value, high heat insulativity, excellent resistance to damp and heat, excellent cohesiveness, excellent tenacity and rigidity and excellent processability.

Description

technical field [0001] The invention relates to a resin composition and its application, especially a high-performance prepreg for high-frequency, packaging, and high-density interconnection, a metal-foil-clad laminate, and an interlayer insulating film. Background technique [0002] In recent years, information terminals such as personal computers and servers, and communication equipment such as Internet routers and optical communications process large-capacity information at high speeds, and the high-speed and high-frequency electrical signals are advancing. The integrity of high-speed high-frequency products is the focus of attention. Therefore, expect to provide a kind of thermosetting resin composition, the printed circuit board material that uses this thermosetting resin composition to make can show sufficiently low low dielectric constant and low dielectric constant in the high-speed, high-frequency signal transmission process. loss tangent. [0003] In the prior ar...

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Application Information

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IPC IPC(8): C08G59/42C08G59/68C08L63/00C08L79/04C08L79/08B32B15/09B32B15/092B32B15/20B32B37/06B32B37/10
CPCB32B15/09B32B15/092B32B15/20B32B37/06B32B37/10B32B2307/306C08G59/4238C08G59/686C08G59/687C08L63/00C08L2203/20C08L79/04C08L79/08
Inventor 崔春梅戴善凯罗鹏辉肖升高陈诚张明军谌香秀任科秘袁告
Owner SHENGYI TECH SUZHOU
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