Manufacturing method of Si-O-C ceramic flexible substrate

Abstract

The invention discloses a manufacturing method of a Si-O-C ceramic flexible substrate, and relates to a ceramic substrate. The method comprises the following steps: cutting continuous inorganic fiber plain cloth to form a sample A; paving the sample A on a flat plate, sealing, and performing vacuum pumping to obtain a sample B; dissolving organic silicone resin into a solvent to obtain an organic silicone resin solution C; in a state of keeping one end of the sample B being vacuum-pumped, introducing the organic silicone resin solution C with a catheter, infiltrating the fiber cloth, and enclosing one end communicated with the resin after infiltration to form a sample D; performing vacuum pumping on the sample D, volatilizing the solvent until the resin is sized, stopping vacuum pumping to obtain a plate-like solid E, placing the plate-like solid E in a blast oven, heating, reacting the organic silicone resin with oxygen in hot air, and performing cross-linking to form an Si-O-Si bond in order to obtain a crosslinking product F; placing the crosslinking product F in a tubular furnace, heating, and cooling to the room temperature to obtain a pyrolysis product G, namely, the Si-O-C ceramic flexible substrate.

Description

technical field [0001] The invention relates to a ceramic substrate, in particular to a preparation method of a Si-O-C ceramic flexible substrate. Background technique [0002] In recent years, the integrated circuit industry has developed rapidly in my country. Among them, the substrate material is an important material for connecting and supporting electronic devices. Its performance determines the performance, quality and manufacturing level of integrated circuits (Zeng Xiaoliang, Sun Rong, Yu Shuhui, Xu Jianbin, Wang Zhengping. Research progress and development trend of electronic packaging substrate materials[J]. Integrated Technology, 2014,3 (6):76-83). At present, my country has made great progress in the preparation and technology of substrate materials. However, there is an obvious gap between my country's advanced electronic product manufacturing enterprises and foreign enterprises, and most of the high-end substrate materials rely on imports. [0003] Traditio...

AI Technical Summary

Problems solved by technology

Among them, such as Al 2 o 3 , AlN, SiC, BN and other ceramic substrates have carried out a lot of basic research and applied research (Qi Weijing, Preparation of high-power LED aluminum nitride ceramic heat dissipation substrate [D]. Nanchang University, Nanchang, 2012.), but the disadvantages of ceramics are High brittleness, simple ceramic substrates cannot be used as flexible substrates

Metal materials such as Cu, Al, etc. can be used as circuit substrate materials, which have outstanding advantages such as stable chemical properties, heat resistance, and bendability, but the disadvantages of metals are heavy weight, high plasticity, and poor deformation recovery ability; in addition, metals are mostly conductors. When used as a substrate, an insulating layer must be coated on its surface. The insulating layer and the metal substrate are prone to "peeling" during the heating and cooling process, which affects the performance stability of the circuit substrate; the preparation of the coating also increases the process cost.

Images