Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Resin composition for forming cured film, cured film, electrically conductive member, and method for preventing migration

A technology of resin composition and cured film, applied to conductive layers, coatings and other directions on insulating carriers, can solve the problems of inapplicable film substrate coating, lack of flexibility, cracks, etc., to inhibit the migration of metals, Excellent flexibility and the effect of maintaining light transmittance

Inactive Publication Date: 2017-03-22
NISSAN CHEM IND LTD
View PDF9 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the conventional methods containing inorganic particles, etc., have improved hardness, but do not have flexibility, for example, disadvantages such as cracks occur in the case of bending, so the current situation is not suitable for coating on film substrates.

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Resin composition for forming cured film, cured film, electrically conductive member, and method for preventing migration
  • Resin composition for forming cured film, cured film, electrically conductive member, and method for preventing migration
  • Resin composition for forming cured film, cured film, electrically conductive member, and method for preventing migration

Examples

Experimental program
Comparison scheme
Effect test

preparation example Construction

[0116] [Preparation method of composition]

[0117] The method for preparing the composition of the present invention is not particularly limited. As an example, the method which melt|dissolves (A) component in (C) solvent, mixes (B) component by predetermined ratio in this solution, and makes a uniform solution is mentioned. Moreover, the manufacturing method of adding (D)-(H) component and other components further as needed in the appropriate stage of this manufacturing method, and mixing is mentioned.

[0118] At the time of preparation of the composition of this invention, the solution of (A) component obtained by the polymerization reaction in a solvent can be used as it is. In this case, (B) component etc. are put into the solution of this (A) component as mentioned above, and it sets as a uniform solution. In addition, in order to adjust the concentration, (C) solvent may be further added.

[0119] The composition in the solution state prepared in this way is prefera...

Embodiment

[0132] Hereinafter, the present invention will be described in more detail with reference to synthesis examples, examples, and comparative examples, but the present invention is not limited to the following examples. It should be noted that the weight average molecular weight (Mw) of the copolymer obtained in the synthesis example was measured using a Showa Denko Co., Ltd. GPC device (Shodex GPC-101) (columns: Shodex (registered trademark) KF8031 and KF8041 (Showa Denko Co., Ltd. ) production)) and measure under the conditions that tetrahydrofuran, an eluting solvent, flows through the column at a flow rate of 1 mL / min (column temperature: 40° C.) to elute. In addition, Mw is represented by the polystyrene conversion value.

[0133] In addition, the reagents and apparatuses used in the following synthesis examples, examples, and comparative examples are as follows.

[0134] ・DEGMEA (diethylene glycol monoethyl ether acetate), MMA (methyl methacrylate), MAA (methacrylic acid),...

Synthetic example 1

[0144] 532.0 g of DEGMEA was placed in a 1,000 mL four-necked flask, and 280.0 g of MMA, 30.1 g of MAA, 36.5 g of ST, and A mixed solution of MAIB 8.1g. After dripping, it was made to react at 70 degreeC for 20 hours, and resin solution P1 was obtained. It should be noted that the molar ratio of the monomer units in the resin ((meth)acrylate polymer) contained in the resin solution is MMA unit: MAA unit: ST unit=80:10:10, and its Mw is about 50000.

[0145] [2] Production of resin composition for forming a cured film, production of a cured film and its evaluation

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

PropertyMeasurementUnit
boiling pointaaaaaaaaaa
viscosityaaaaaaaaaa
Login to View More

Abstract

Provided is a resin composition for forming a cured film, said resin composition comprising: (A) a (meth)acrylate polymer having a weight average molecular weight of 5,000 to 200,000 (excluding a (meth)acrylate polymer having a silane structure in a side chain thereof); (B) an agent capable of preventing migration and also capable of trapping ions, which comprises a benzotriazole compound; and (C) a solvent.

Description

technical field [0001] The present invention relates to a resin composition for forming a cured film, a cured film, a conductive member, and a method for inhibiting migration. Background technique [0002] Conventionally, protective films, insulating films, and the like required for touch panels and the like have been formed at necessary locations by patterning using photolithography using a photosensitive resin composition (Patent Document 1). [0003] However, patterning by photolithography has a problem of not only complicated steps but also high costs. Therefore, there is a demand for a composition capable of forming a protective film, an insulating film, and the like at necessary locations using a more simple method and at low cost. [0004] In addition, the use of film substrates instead of glass substrates has been increasing due to demands on transportation and storage. The film substrate is stored in a roll or the like during storage. At this time, since the subst...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): C08L33/06C08K5/103C08K5/3495C08K5/54C09D4/02C09D7/12C09D133/06H01B5/14
CPCC09D133/06C08K5/103C08K5/3495C08K5/54C08L33/06H01B5/14C09D7/40C08K5/3475C08L33/10C09D133/10C09D7/63C08K5/10
Inventor 服部隼人山田智久
Owner NISSAN CHEM IND LTD
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com