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Ultraviolet LED encapsulation method

A technology of LED packaging and LED chips, applied in semiconductor devices, electrical components, circuits, etc., can solve the problems of affecting chip performance, easy aging of materials, loss of sealing performance, etc., to achieve uniform protective film, improve cleanliness, and prolong sealing time. Effect

Active Publication Date: 2017-03-22
QINGDAO JASON ELECTRIC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] In order to solve the technical problem that the material used in the existing ultraviolet LED packaging method is easy to age, and the loss of se

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Example Embodiment

[0033] Example one

[0034] This embodiment proposes a UV LED packaging method, such as figure 1 As shown, including the following steps:

[0035] S11. In the die bonding step, the ultraviolet LED chip is secured in the die bonding area in the substrate cavity;

[0036] This embodiment uses the chip-on-board packaging technology, such as figure 2 As shown, a substrate 11 is included. The substrate 11 has a cavity 13 for accommodating the chip 12.

[0037] S12, the wire bonding step, connect the ultraviolet LED chip with the relevant circuit terminal with a wire;

[0038] S13. Plasma coating step: place the substrate with the UV LED chip fixed in the spraying chamber, and the spraying chamber is drawn into a low-pressure vacuum state, and spraying agent is sprayed on the surface of the UV LED chip and the substrate cavity for plasma coating, on the surface of the UV LED chip And the inner surface of the substrate cavity to form a protective film, the composition of the protective film ...

Example Embodiment

[0048] Example two

[0049] This embodiment proposes another UV LED packaging method, such as image 3 As shown, including the following steps:

[0050] S21, the die bonding step, fixing the ultraviolet LED chip in the die bonding area in the substrate cavity;

[0051] This embodiment adopts the chip-on-board packaging technology, such as Figure 4 As shown, a substrate 11 is included. The substrate 11 has a cavity 13 for accommodating the chip 12.

[0052] S22, the wire bonding step, connect the ultraviolet LED chip with the relevant circuit terminal with a wire;

[0053] S23. The step of sealing the cover plate, sealing the cover plate which transmits ultraviolet light on the mouth of the substrate cavity.

[0054] S24. Plasma coating step: place the substrate with the cover plate in the spraying chamber, and the spraying chamber is evacuated into a low-pressure vacuum state, and spraying agent is sprayed on the surface of the cover plate and the side wall of the joint between the cov...

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Abstract

The invention discloses an ultraviolet LED encapsulation method. The ultraviolet LED encapsulation method comprises the following steps: (11), a solid crystallization step: fixedly arranging an ultraviolet LED chip in a solid crystallization region in a substrate cavity; (12), a bonding step: connecting the ultraviolet LED chip with a related circuit terminal by using a conductor wire; (13), a plasma coating step: putting a substrate fixed with the ultraviolet LED chip in a spraying chamber, vacuumizing the spraying chamber in a low-pressure vacuum state, and performing plasma coating on the surface of the ultraviolet LED chip and in the substrate cavity; and (14), a cover plate sealing step: sealing an ultraviolet transmission cover plate at the opening part of the substrate cavity. By means of the ultraviolet LED encapsulation method disclosed by the invention, a layer of protective film can be additionally increased on the ultraviolet LED chip; therefore, aging of the cover plate can be delayed; the sealing time of the cover plate can be prolonged; the opening part of the substrate cavity is sealed by the ultraviolet transmission cover plate; and thus, the problem that the luminous efficiency is low due to the fact that the ultraviolet resistant performance of epoxy resin or silica gel is relatively poor can be solved.

Description

technical field [0001] The invention belongs to the technical field of semiconductor encapsulation, and in particular relates to an ultraviolet LED encapsulation method. Background technique [0002] There are two main forms of UV LED bare chip packaging technology: one is Chip On Board (COB) technology, and the other is flip chip technology. As far as the COB process is concerned, the semiconductor chip is handed over and mounted on the substrate through the crystal-bonding process, and then electrically connected between the chip and the substrate by wire bonding, and finally poured on the chip with resin. The surface of the chip and bracket is covered and then cured to complete the package. The connection between the commonly used epoxy resin or silica gel and the LED chip or substrate is easy to crack due to aging and other reasons after long-term use, resulting in loss of sealing performance, and the outside air directly contacts the chip. , affecting the performance o...

Claims

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Application Information

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IPC IPC(8): H01L33/00H01L33/48H01L33/54H01L33/62
CPCH01L33/005H01L33/48H01L33/54H01L33/62H01L2933/0066H01L2933/005H01L2924/16195H01L2224/16145H01L2224/48091H01L2224/48227H01L2924/00014
Inventor 白生茂曲丞世张晓裴潘娜王洁武帅周德保梁旭东
Owner QINGDAO JASON ELECTRIC
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