Hard and brittle material micro cutting processing system under ultrasonic effect

Abstract

The invention discloses a hard and brittle material micro cutting processing system under the ultrasonic effect. The system is formed by connecting an integrated machine-detection mechanism and a control mechanism through a drag chain a and a drag chain b. The system solves the problem that micro cutting processing is difficult to carry out on the plastic region of the hard and brittle material.

Description

technical field [0001] The invention belongs to the technical field of material processing equipment, and in particular relates to a micro-cutting processing system for hard and brittle materials under the action of ultrasound. Background technique [0002] Due to the special properties superior to ordinary materials, hard and brittle materials are more and more widely used in high-tech fields such as aerospace. [0003] Common hard and brittle materials mainly include: quartz glass, silicon carbide, silicon, ceramics, etc. Compared with ordinary materials, hard and brittle materials have the advantages of high hardness, high thermal conductivity, wear resistance, high temperature resistance, good chemical stability, not easy to oxidize and corrode, and low thermal expansion coefficient. However, due to the obvious hardness and brittleness of hard and brittle materials, conventional cutting is very difficult. [0004] In recent years, some scholars have confirmed that the ...

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Problems solved by technology

[0006] The purpose of the present invention is to provide a micro-cutting system for hard and brittle materials under the action of ultrasound, which solves the problem of difficult micro-cutting in the plastic domain of hard and brittle materials, and can realize micro-cutting of different hard and brittle materials in their plastic domains

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