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Composite electronic component and preparation method thereof

A technology of electronic components and electrode layers, applied in electrical components, circuits, capacitors, etc., can solve problems such as unfavorable miniaturization of the whole machine, multiple circuit spaces, and low mounting efficiency.

Active Publication Date: 2017-02-22
GUANGDONG FENGHUA ADVANCED TECH HLDG
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In many circuit applications, when it is necessary to use a circuit with a series structure of resistors and capacitors, discrete components are generally used, that is, resistors are mounted outside the capacitors, and the mounting efficiency is low, forming a single resistor and a single capacitor, which takes up more circuits. Space is not conducive to the miniaturization of the whole machine

Method used

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  • Composite electronic component and preparation method thereof
  • Composite electronic component and preparation method thereof
  • Composite electronic component and preparation method thereof

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preparation example Construction

[0069] The flowchart of the preparation method of the composite electronic component of one embodiment is as follows Figure 12 As shown, the following steps S110-S150 are included.

[0070] S110, providing a ceramic body.

[0071] Wherein, the ceramic body is a cuboid, and the ceramic body has a first end surface and a second end surface opposite to each other, and four side surfaces connecting the first end surface and the second end surface. The inside of the ceramic body is filled with a ceramic medium, and a plurality of first electrode layers and a plurality of second electrode layers are interspersed in the ceramic medium, and the first electrode layers and the second electrode layers are alternately stacked, and the first electrode layers are on the second electrode layers The projection of and the second electrode layer overlap, and the space between the first electrode layer and the second electrode layer is filled with a ceramic medium. At least one part of the fi...

Embodiment 1

[0122] Preparation of composite electronic components

[0123] 1) Preparation of a ceramic body: ceramic powder, a binder and an organic solvent are mixed to obtain a ceramic slurry, and a plurality of ceramic dielectric films are formed by casting the ceramic slurry as a raw material. Wherein, the ceramic slurry includes 10 parts of ceramic powder, 4 parts of binder and 5 parts of organic solvent in parts by mass. The ceramic powder is barium titanate ceramics, the binder is polyvinyl butyral, and the organic solvent is a mixed solvent of toluene and ethanol with a ratio of parts by mass of 1:1. The electrode paste is printed on a plurality of ceramic dielectric films to respectively obtain a ceramic dielectric film printed with a first electrode layer and a ceramic dielectric film printed with a second electrode layer. The screen pattern of the first electrode layer and the second electrode layer is as Figure 15 As shown, the shaded part indicates where the electrode past...

Embodiment 2

[0130] The preparation method of the composite electronic component of this embodiment is similar to that of Embodiment 1, except that it further includes coating an electrode paste on the second end surface of the ceramic body to form a second connecting electrode. Then, the resistance paste is dipped on the second end surface covered with the second connection electrode to obtain a second resistance layer, and the second resistance layer and the surface electrode have overlapping portions. Then cover the electrode paste on the second resistance layer to form a second terminal electrode.

[0131] The specific structure of the composite electronic component of this embodiment is as Figure 7 ~ Figure 10 As shown, the equivalent circuit is as Figure 11 shown.

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Abstract

The invention relates to a composite electronic component and a preparation method thereof. According to the composite electronic component, a capacitor and a resistor are integrated into a single component; a surface electrode is arranged on the side surface of a ceramic body; one end of the surface electrode is electrically connected with a first resistor layer; the other end of the surface electrode is electrically connected with a second terminal electrode; and one resistor connected with the capacitor in parallel is formed through the surface electrode between a first terminal electrode and the second terminal electrode to play a role in protecting the capacitor. The composite electronic component is wide in application range and relatively small in size; and the space can be saved for an overall circuit.

Description

technical field [0001] The invention relates to the technical field of electronic components, in particular to a composite electronic component and a preparation method thereof. Background technique [0002] Capacitors can be used for direct traffic isolation, filtering and energy storage, etc., and have a wide range of applications in power transmission, power distribution, and power consumption. In many circuit applications, when it is necessary to use a circuit with a series structure of resistors and capacitors, discrete components are generally used, that is, resistors are mounted outside the capacitors, and the mounting efficiency is low, forming a single resistor and a single capacitor, which takes up more circuits. Space is not conducive to the miniaturization of the whole machine. Contents of the invention [0003] Based on this, it is necessary to provide a composite electronic component with a smaller size and a preparation method thereof. [0004] A composite...

Claims

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Application Information

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IPC IPC(8): H01G4/30
CPCH01G4/30H01G4/306
Inventor 陆亨李江竹卓金丽安可荣唐浩宋子峰杨晓东
Owner GUANGDONG FENGHUA ADVANCED TECH HLDG
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