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Motherboard of display panel and manufacturing method of display panel

A technology of a display panel and a manufacturing method, which are applied in the field of display panel manufacturing and display panel motherboards, can solve the problems of deformation and damage of flexible substrates and display components, affecting the electrical performance of display components, and many residues, etc. The effect of peeling yield, improving peeling yield, and saving manufacturing time

Active Publication Date: 2017-11-10
BOE TECH GRP CO LTD +1
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] However, in the above-mentioned process of peeling the flexible display panel and the rigid substrate to obtain the flexible display panel, if the operation is improper, it is easy to cause problems such as poor peeling, deformation and damage of the flexible substrate and display components, and excessive residues after separation. , affecting the electrical properties of display components, resulting in a drop in yield, which is an urgent problem that needs to be solved in flexible display devices

Method used

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  • Motherboard of display panel and manufacturing method of display panel
  • Motherboard of display panel and manufacturing method of display panel
  • Motherboard of display panel and manufacturing method of display panel

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Embodiment Construction

[0062] Specific embodiments of the present invention will be described in detail below in conjunction with the accompanying drawings. It should be understood that the specific embodiments described here are only used to illustrate and explain the present invention, and are not intended to limit the present invention.

[0063] refer to figure 1 , the first aspect of the present invention relates to a display panel motherboard 100 . Wherein, the display panel motherboard 100 includes a rigid substrate 110 and a flexible substrate 120 , and the rigid substrate 110 is disposed opposite to the flexible substrate 120 .

[0064] The display panel motherboard 100 also includes a liquid affinity adjustable layer 130 . Wherein, the liquid affinity adjustable layer 130 is arranged between the rigid substrate 110 and the flexible substrate 120 , and the liquid affinity adjustable layer 130 bonds the flexible substrate 120 to the rigid substrate 110 .

[0065] It should be noted that th...

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Abstract

The invention discloses a display panel motherboard and a manufacturing method of the display panel, which belong to the field of display technology. The display panel motherboard includes a rigid substrate and a flexible substrate, and the display panel motherboard also includes a liquid affinity adjustable layer arranged between the rigid substrate and the flexible substrate, and the liquid affinity A degree-tunable layer bonds the flexible substrate to the rigid substrate. The adjustable liquid affinity layer provided on the motherboard of the display panel of the present invention can improve the peeling yield of the motherboard of the display panel.

Description

technical field [0001] The invention relates to the field of display technology, in particular to a display panel mother board and a display panel manufacturing method. Background technique [0002] In general, flexible display devices are made of very thin flexible substrates. Compared with traditional displays, flexible display devices have the advantages of ultra-thin, light weight, durability, large storage capacity, free design, and rollability. They have been widely used in Display products, especially for mobile communication devices. At present, the research on flexible display devices mainly includes flexible organic electroluminescent display (Flexible Organic Light Emitting Diode, FOLED), flexible electronic ink display, also known as flexible electrophoretic display (Flexible Electrophoretic Display, FEPD) and flexible liquid crystal display (Flexible Liquid Crystal). Display, FLCD). [0003] The substrate of the display panel of the above-mentioned flexible di...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G09F9/30H10K99/00
CPCG09F9/301G02F1/133305Y02E10/549Y02P70/50H10K71/191H10K71/80H10K77/111H10K2102/311H05K1/118
Inventor 徐元杰
Owner BOE TECH GRP CO LTD
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