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How to use the adhesive sheet

A technology for bonding sheets and core boards, which is applied in the manufacture of multi-layer circuits, printed circuits, electrical components, etc. It can solve the problems of layer deviation and scrap, waste of raw materials, and low production efficiency, and achieve the effect of ensuring consistency.

Active Publication Date: 2019-12-03
DONGGUAN SHENGYI ELECTRONICS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Although this method can solve the scrap caused by layer deviation to a certain extent, it needs to test multiple batches of verification, resulting in low production efficiency and waste of raw materials
At the same time, this method does not consider the influence of the adhesive sheet on the expansion and contraction of the core board size, resulting in the core board being easily affected by the PCB processing process and resulting in layer deviation and scrapping caused by the out-of-tolerance expansion and contraction of the core board size.

Method used

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  • How to use the adhesive sheet

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Embodiment Construction

[0035] The technical solutions of the present invention will be further described below in conjunction with the accompanying drawings and through specific implementation methods.

[0036] Such as figure 1 A method for using a bonding sheet shown, comprising the following steps:

[0037] S10. Provide a core board, and manufacture at least four copper discs on the core board.

[0038] In this embodiment, the provided core board is rectangular, and the copper discs are arranged on the diagonal of the core board and along the length directions of the four sides. Of course, in other embodiments, if the core board is rectangular, the copper disks can be separately arranged on the two diagonal lines of the core board or the copper disks can be separately arranged on the length directions of the four sides of the core board.

[0039] Specifically, copper discs are fabricated on the core board by etching. The number of core boards provided is multiple, and the specifications of each...

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Abstract

The invention discloses a use method for adhesive sheet which belongs to a PCB manufacturing field and comprises the following steps: providing a core plate; preparing at least four copper plates on the core plate; measuring the distances among the copper plates and recording them as initial distances; setting an identical adhesive sheet respectively at the upper side and the lower side of the core plate; and setting a copper foil at the side of the adhesive sheet away from the core plate; performing lamination to the adhesive sheet and the core plate; measuring the distances among the copper plates after the lamination process of the copper foil, the adhesive sheet and the core plate and recording them as the final distances; calculating the difference between the final distances and the initial distances and recording it as the change value; and based on the measured initial distances and the final distances among the copper plates, obtaining the size changing trend of the adhesive sheet so as to infer the influence of the adhesive sheet on the size of the core plate in the PCB manufacturing process.

Description

technical field [0001] The invention relates to the field of PCB production, in particular to a method for using an adhesive sheet. Background technique [0002] Because the adhesive sheet contains resin, it changes from a semi-cured state to a cured state under the action of high temperature and high pressure in the lamination process. There are multiple core boards in a multi-layer PCB. When making a multi-layer PCB, the dimensional change values ​​of the core boards are also different due to the different dimensional changes of the bonding sheets of different glass cloths during the lamination process. If the size of each core board is inconsistent, it will lead to failure modes such as inner layer short circuit and inner layer open circuit due to layer deviation. At present, the way to prevent layer deviation is to make one or more batches of boards first, measure the expansion and contraction values ​​of the core boards of each layer, give a pre-compensation coefficien...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K3/46
CPCH05K3/4638H05K2203/163
Inventor 王祥王洪府纪成光李民善何思良
Owner DONGGUAN SHENGYI ELECTRONICS
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