Tooling for chip cutting experiment and method

A chip and experimental technology, applied in the manufacturing of electrical components, electric solid-state devices, semiconductor/solid-state devices, etc., can solve the problems of poor manual cutting accuracy, slow speed, high cost, etc. flexible effects

Active Publication Date: 2017-02-15
BEIJING INST OF RADIO MEASUREMENT
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The technical problem to be solved by the present invention is to provide a tooling and method for chip cutting experiments that are suitable for small-scale use of chips or chip experimental research, and can solve the problems of poor manual cutting accuracy, slow speed, and low efficiency.
[0005] The beneficial effects of the present invention are: the microwave probe station is used to complete the chip cutting experiment, which is suitable for institutions such as small-scale use of chips or chip experimental research, avoiding the high cost of purchasing and maintaining a special chip cutting machine, and saving experimental costs; in addition, the present invention The invention is flexible in operation and is suitable for some specific chip cutting experiments; it solves the problems of poor precision, slow speed and low efficiency of manual cutting at present

Method used

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  • Tooling for chip cutting experiment and method
  • Tooling for chip cutting experiment and method
  • Tooling for chip cutting experiment and method

Examples

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Embodiment Construction

[0032] The principles and features of the present invention are described below in conjunction with the accompanying drawings, and the examples given are only used to explain the present invention, and are not intended to limit the scope of the present invention.

[0033] Such as figure 1 Or as shown in 2, a kind of tooling that is used for the chip cutting experiment of this embodiment, in the chip cutting experiment, the wafer is cut into a chip or the chip is cut, including a microwave probe station, a connector 2 and a cutting blade 3; The probe station includes a base 1 and a mechanical displacement device slidingly connected to the base 1. The other end of the mechanical displacement device is fitted with one end of the connector 2 for driving the connector 2 to move. The cutting blade 3 It is fixedly installed with the other end of the connector 2, and the cutting blade 3 is located above the wafer or chip to be cut.

[0034] The microwave probe station in this embodim...

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PUM

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Abstract

The invention relates to a tooling for chip cutting experiment and method. The tooling comprises a microwave probe station, a connecting piece and a cutting blade; the microwave probe station comprises a base and a mechanical shift device in sliding connection with the base; the other end of the mechanical shift device is well matched with one end of the connecting piece and used for driving the connecting piece to move, the cutting blade is fixedly installed on the other end of the connecting piece, and is located above a chip. The microwave probe station is used for finishing the chip cutting experiment, the tooling disclosed by the invention is suitable for organizations with small chip usage amount or the chip experiment research, the high cost caused by purchasing a dedicated chip cutter is avoided, and the experiment cost is saved; and furthermore, the tooling is flexible in operation, and suitable for some specific chip cutting experiment.

Description

technical field [0001] The invention relates to the field of chip cutting, in particular to a tooling and method for chip cutting experiments. Background technique [0002] During semiconductor chip manufacturing, wafers need to be diced into individual chips. The existing chip dicing methods mainly include knife dicing and radiant energy dicing. Both methods require a dedicated chip cutting machine to complete, and are suitable for places where there are a large number of chip cutting tasks such as chip manufacturers or chip cutting agents. For institutions that use a small amount of chips or chip experimental research, the cost of purchasing and maintaining corresponding equipment is relatively high. high. At the same time, the current chip dicing method is a general-purpose method for large-volume chip dicing, which is difficult to meet the needs of some specific chip dicing experiments and flexibility. Contents of the invention [0003] The technical problem to be s...

Claims

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Application Information

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IPC IPC(8): H01L21/67H01L21/02H01L21/66
CPCH01L21/02H01L21/67092H01L22/20H01L2221/67
Inventor 蔡得水高瞻扬威
Owner BEIJING INST OF RADIO MEASUREMENT
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