Cooling device of LED array device

Abstract

The invention discloses a cooling device of an LED array device. The cooling device comprises multiple pipe-shaped evaporators, a condensation chamber, heat dissipating manifolds and a center heat dissipating manifold; the condensation chamber includes a cylindrical main body opened in the top and a circular cover plate; the circular cover plate includes a conical condensation top inwards recessed; multiple heat dissipating manifolds are inserted in the conical condensation top; the pipe-shaped evaporators are spaced on a main body baseplate of the condensation chamber in an array form, and penetrate through substrates to extend among LED arrays; phase changeable working mediums are filled in the pipe-shaped evaporators; the top of a heat dissipating part is fixedly connected with the center heat dissipating manifold; the center heat dissipating manifold includes a center heat conducting part, a bridge part and a heat transfer flange connected integrally; the heat transfer flange is fixed on a mounting plate of an illuminating device; and the center heat conducting part is fixedly connected with the heat dissipating part. The cooling device of the LED array device solves the technical difficulties of quick heat dissipation and uniform heat dissipation with low cost and simple structure.

Description

technical field [0001] The invention relates to the technical field of LED array devices, in particular to a cooling device for LED array devices. Background technique [0002] As an active self-luminous device, LED is a solid-state lighting that does not burn filaments or gases. It has low power consumption, low operating voltage, high luminous brightness, long working life, and stable performance. It can work in extreme environments with little performance attenuation. Due to its characteristics, it has been widely used. Since multiple shadows are reduced when multiple LEDs are gathered, the tight gathering of LEDs, that is, LED array devices, came into being. The LED array device is a two-dimensional array of micro-sized highly light-emitting diode cores arranged in high-density integration on the same epitaxial substrate material, and each LED is a high-power LED with a power greater than 0.5W. And when the LEDs are extremely close to each other, overheating will occur....

AI Technical Summary

Problems solved by technology

Since the heat generated on the front side can only be taken away from the back side, the heat dissipation efficiency is poor, which affects the service life of the LED array device to a certain extent

There are also multiple copper tubes that pass through the space between the LED arrays on the substrate to dissipate heat, but a forced-flow ventilation fan is required on the back of the substrate to meet the cooling and heat dissipation requirements.

This has led to a significant increase in the power consumption of the forced-flow ventilation fan, and has also increased the manufacturing cost.

[0004] At the same time, in order to cool the LEDs on the tightly packed substrate, the cost of manufacturing LEDs and using LEDs increases

For example, more than 70% of the electricity cost of LED array devices is consumed by forced air fans for cooling

The heat dissipation layer added during the manufacturing process also increases the cost of the LED array device

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