Heat-conduction double-sided bonded graphite flake

Abstract

The invention discloses a heat-conduction double-sided bonded graphite flake. The heat-conduction double-sided bonded graphite flake is arranged between a heat dissipation part and a heating part in a close contact way and comprises a light-stripped PET film and a heavily-stripped PET film, a first heat-conduction adhesive layer, a graphite layer and a second heat-conduction adhesive layer are sequentially arranged between the light-stripped PET film and the heavily-stripped PET film, an upper surface and a lower surface of the graphite layer on a polyimide film are respectively coated with a layer of graphite modifier to obtain the processed polyimide film, and the graphite modifier comprises the following constituents based on part by weight: 22 parts of benzophenone dianhydride, 15.6 parts of pyromellitic dianhydride, 26 parts of diaminodiphenylmethane, 32 parts of dimethylformamide, 1.8 parts of ethylene glycol and 2.2 parts of polydimethylsiloxane. A calendaring machine is used for calendaring a pre-sintered carbonization film, and draped lines and volume shrinkage during graphitization sintering process are prevented.

Description

technical field [0001] The invention relates to a thermally conductive double-sided adhesive graphite sheet, which belongs to the technical field of double-sided adhesive sheets. Background technique [0002] With the rapid development of modern microelectronics technology, electronic devices (such as laptops, mobile phones, tablet computers, etc.) are increasingly becoming ultra-thin and lightweight. This structure makes the internal power density of electronic devices significantly increased, and the heat generated during operation is not easy to discharge , Easy to accumulate rapidly and form high temperature. On the other hand, high temperatures can reduce the performance, reliability and lifespan of electronic equipment. Therefore, the current electronics industry has put forward higher and higher requirements for heat dissipation materials as the core components of thermal control systems, and there is an urgent need for a highly efficient heat-conducting, lightweight...

AI Technical Summary

Problems solved by technology

[0003] In the prior art, polyimide films are mostly used for flexible circuit boards. Although polyimide films are sintered to obtain graphite heat sinks, which can be pasted on heat sources, they are limited by the quality and quality of polyimide films. The performance is uneven, which affects the heat dissipation performance of the heat dissipation double-sided film. There are the following technical problems: uneven heat dissipation, prone to local overheating of the tape, improved product heat dissipation performance instability, poor reliability performance, and is not conducive to product quality control. affect product competitiveness

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