Manufacturing process for high-thermal-conductivity graphite film

Abstract

The invention discloses a manufacturing process for a high-thermal-conductivity graphite film. The manufacturing process comprises the following steps of heating a polyimide thin film from the room temperature to 250 DEG C at a heating speed of 4-6 DEG C / min, keeping the temperature for 0.9-1.1h, then heating to 400 DEG C at a heating speed of 2.5-3.5 DEG C / min, and keeping the temperature for 1h and then reducing to the room temperature; and coating the upper surface and the lower surface of the polyimide thin film obtained in the step one with a layer of graphite modifying agent to obtain a processed polyimide thin film, wherein the graphite modifying agent comprises the following components in parts by weight: 23 parts of benzophenone tetracid dianhydride, 12 parts of pyromellitic dianhydride, 26.5 parts of diaminodiphenylmethane, 34 parts of dimethyl formamide, 2.2 parts of ethylene glycol and 2 parts of polydimethylsiloxane. By adoption of the manufacturing process, pin holes in the heating process are filled, thereby improving degree of crystallinity, overcoming nonuniformity caused by overhigh thermal shrinkage, and improving the bidirectional tensile property of the graphite layer.

Description

technical field [0001] The invention relates to a high thermal conductivity graphite film, which belongs to the technical field of double-sided adhesive sheets. Background technique [0002] With the rapid development of modern microelectronics technology, electronic devices (such as laptops, mobile phones, tablet computers, etc.) are increasingly becoming ultra-thin and lightweight. This structure makes the internal power density of electronic devices significantly increased, and the heat generated during operation is not easy to discharge , Easy to accumulate rapidly and form high temperature. On the other hand, high temperatures can reduce the performance, reliability and lifespan of electronic equipment. Therefore, the current electronics industry has put forward higher and higher requirements for heat dissipation materials as the core components of thermal control systems, and there is an urgent need for a highly efficient heat-conducting, lightweight material to quick...

AI Technical Summary

Problems solved by technology

[0003] In the prior art, polyimide films are mostly used for flexible circuit boards. Although polyimide films are sintered to obtain graphite heat sinks, which can be pasted on heat sources, they are limited by the quality and quality of polyimide films. The performance is uneven, which affects the heat dissipation performance of the heat dissipation double-sided film. There are the following technical problems: uneven heat dissipation, prone to local overheating of the tape, improved product heat dissipation performance instability, poor reliability performance, and is not conducive to product quality control. affect product competitiveness

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